NPI Process Development Engineer - Automotive Packaging

NXP Semiconductors; Kuala Lumpur; On-site; MYR 60,000 - 100,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking a Packaging Engineer to develop and qualify LQFP and BGA packages for automotive assembly. You will drive quality, yield, cost and process improvements while maintaining comprehensive process documentation.

The role requires close collaboration with cross-functional teams, rapid decision-making to mitigate risks, and ownership of major projects in a dynamic automotive environment.

Qualifications

• 3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
• Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem-solving skills
• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

Responsibilities

• Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality, yield, cost and process improvement activities.
• Maintain process documentation, process specs, standard work instructions, OCAP, QIT, etc.
• Collaborate with cross-functional teams to resolve conflicts and make fast decisions to mitigate risks.
• Take ownership and align scope and direction of key projects with upper management.

Skills

Leadership

Project Management

Problem Solving

Interpersonal Skills

LQFP Packaging

MAPBGA

SiP

Packaging Knowledge

Tools

PowerPoint

Excel

Word

Excel Macro

Job description

NXP Semiconductors Malaysia is seeking a Packaging Engineer to develop and qualify LQFP and BGA packages for automotive assembly. You will drive quality, yield, cost and process improvements while maintaining comprehensive process documentation.

The role requires close collaboration with cross-functional teams, rapid decision-making to mitigate risks, and ownership of major projects in a dynamic automotive environment.