NPI Process Development Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 60,000 - 100,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking a Packaging Engineer to develop and qualify LQFP and BGA packages for automotive assembly. You will drive quality, yield, cost and process improvements while maintaining comprehensive process documentation.

The role requires close collaboration with cross-functional teams, rapid decision-making to mitigate risks, and ownership of major projects in a dynamic automotive environment.

Qualifications

• 3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
• Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem-solving skills
• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

Responsibilities

• Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality, yield, cost and process improvement activities.
• Maintain process documentation, process specs, standard work instructions, OCAP, QIT, etc.
• Collaborate with cross-functional teams to resolve conflicts and make fast decisions to mitigate risks.
• Take ownership and align scope and direction of key projects with upper management.

Skills

Leadership

Project Management

Problem Solving

Interpersonal Skills

LQFP Packaging

MAPBGA

SiP

Packaging Knowledge

Tools

PowerPoint

Excel

Word

Excel Macro

Job description

Responsibilities

• Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality, yield, cost and process improvement activities.
• Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
• Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements

• 3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
• Good technical knowledge and hands‑on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem-solving skills
• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia... #LI-633a NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.

Thank you for considering a career at NXP.