NPI Process Development Engineer - Auto Semiconductors

NXP Limited; Kuala Lumpur; On-site; MYR 60,000 - 120,000; Full time

Job summary

NXP Limited in Malaysia is seeking an experienced engineer to develop and qualify LQFP and BGA packages for automotive total assembly. You will lead process characterization, quality and yield improvements, and ensure robust documentation and specifications.

Collaborate with cross-functional teams, manage tooling and process improvements, and support management on key packaging projects. Strong hands-on skills in laser/plasma dicing, die/bond, wire bonding, and SPC are expected.

Qualifications

• 3-6 years of experience in semiconductor assembly for automotive customers.
• Experience with LQFP, MAPBGA, SiP, FCCSP, FCBGA packages; packing development is a plus.
• Hands-on in laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation.
• Strong interpersonal and leadership skills; result-oriented and self-driven.

Responsibilities

• Develop and qualify new LQFP and BGA packages for total assembly processes in automotive applications.
• Own quality, yield, cost and process improvement activities.
• Manage process documentation, process specs, standard work instructions, OCAP, QIT, etc.
• Collaborate with cross-functional teams to resolve conflicts and make fast decisions to avoid risks.
• Take ownership to align scope and direction of key projects with upper management.

Skills

Semiconductor assembly

Process characterization

Statistical analysis

Microsoft Office

Project Management

Interpersonal skills

Tools

PowerPoint

Excel Macro

Word

Job description

NXP Limited in Malaysia is seeking an experienced engineer to develop and qualify LQFP and BGA packages for automotive total assembly. You will lead process characterization, quality and yield improvements, and ensure robust documentation and specifications.

Collaborate with cross-functional teams, manage tooling and process improvements, and support management on key packaging projects. Strong hands-on skills in laser/plasma dicing, die/bond, wire bonding, and SPC are expected.