NPI Leadframe & Die Attach Manager — Process & Materials

STMicroelectronics

Muar

On-site

MYR 220,000 - 300,000

Full time

5 days ago

Be an early applicant

Application generator

Don’t send a generic resume — generate a resume and cover letter tailored to this exact role.

Get past ATS filters

Job summary

STMicroelectronics in Malaysia is seeking an experienced NPI Leadframe/Die Attach Manager to spearhead new product introductions, process development, and material qualification for leadframe, substrate, and die attach technologies. You will work closely with R&D, manufacturing, quality, supply chain, and equipment vendors to ensure robust transfer and production readiness.

The role emphasizes process standardization, risk mitigation, and continuous improvement across assembly-related

Qualifications

Advanced degree in a related technical field with relevant semiconductor experience.
Experience leading NPI and process transfer for leadframe, substrate, or die attach.
Strong knowledge of materials, process development, and reliability.

Responsibilities

Lead NPI leadframe, substrate, and die attach process team for new product introductions.
Own material qualification from concept to production release.
Define process windows, specifications, and design rules for assembly.
Drive qualification plans, process control, and reliability validation.
Perform risk assessments, root cause analyses, and corrective actions.
Coordinate with R&D, manufacturing, quality, supply chain, and vendors.