NPI Engineer

Carsem; Ipoh; On-site; MYR 90,000 - 130,000; Full time

Job summary

Jora Malaysia is seeking an ambitious New Product Introduction (NPI) Executive to lead NPI, technology development, and manufacturing transfer across semiconductor assembly—from FOL to EOL. You will be the primary technical and project interface between customers, suppliers, manufacturing, and internal teams, driving planning, readiness, and on-time releases.

Applicants should have a Bachelor’s or Diploma in Engineering with a minimum of 3 years in semiconductor packaging/NPI or project

Qualifications

• Bachelor’s Degree or Diploma in Engineering or equivalent technical field.
• 3 years of hands-on experience in semiconductor assembly/packaging with NPI or PM focus.
• PMP or Lean Six Sigma certifications are advantageous.
• Strong cross-functional and customer-facing interface capabilities.

Responsibilities

• End-to-End Leadership: Lead cross-functional NPI projects from kick-off to mass production release.
• Project Planning: Develop and maintain detailed schedules, milestones, risk registers, and contingency plans.
• Performance Monitoring: Track progress against timelines, budgets, quality standards, and milestones.
• Lifecycle Management: Manage NPI from feasibility through qualification, builds, and ramp.
• Customer & Stakeholder Management: Interface with customers and suppliers, lead reviews, and manage ECO/ECR.

Skills

NPI project management

Cross-functional collaboration

Customer & supplier liaison

Project scheduling

Budget/CAPEX management

Risk mitigation

Change control

Semiconductor packaging

Quality methodologies

Education

Bachelor’s Degree in Engineering

Diploma in Engineering

Tools

NPI/PM coordination tools

Quality systems (ISO 9001/IATF 16949)

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

To support our rapid business growth and increasing customer project demand, we are seeking a dynamic New Product Introduction (NPI) Executive to lead NPI, technology development, and manufacturing transfer projects across our semiconductor assembly operations—from Front-End of Line (FOL) through to End-of-Line (EOL).

In this role, you will serve as the primary technical and project management interface between customers, suppliers, manufacturing, and internal cross-functional teams. You will drive project execution excellence, process readiness, and customer satisfaction to ensure successful mass production releases within schedule, budget, and quality requirements.

Key Responsibilities

1. Project Management & NPI Execution

• End-to-End Leadership: Lead cross-functional NPI projects from initial project kick-off all the way through to mass production release.

• Project Planning: Develop and maintain detailed project schedules, milestone plans, risk registers, and robust contingency plans.

• Performance Monitoring: Track and report project performance against timelines, cost budgets, quality standards, and customer milestones.

• Lifecycle Management: Manage NPI activities from initial feasibility assessments through qualification, engineering builds, process characterization, and production ramp.

2. Customer & Stakeholder Management

• Primary Interface: Act as the main technical and project interface for customers throughout the entire project lifecycle.

• Reviews & Changes: Lead customer technical reviews, deliver executive business updates, and manage Engineering Change Requests/Orders (ECR/ECO).

• Collaboration: Coordinate with suppliers regarding materials, tooling, equipment, and process readiness, while aligning internal teams to achieve project goals.

3. Technical Coordination & Process Tracking

• Process Oversight: Coordinate and monitor full-cycle semiconductor assembly processes, including:

  • Wafer Prep, Back Grinding, Dicing, and Die Attach.
  • Flip Chip / Cu Pillar Assembly and Wire Bonding.
  • Molding/Compression Molding, Singulation/Tape Saw, and Trim & Form.
  • Marking, Reliability Qualification, and Packaging/Shipment Readiness.

• Advanced Evaluation: Support package development, DFM/DFX reviews, and evaluate new assembly technologies, materials, tooling, and equipment platforms.

4. Problem Solving & Quality Compliance

• Structured Troubleshooting: Lead structured problem-solving and failure analysis activities using 8D, DMAIC, and Root Cause Analysis (RCA) methodologies.

• Risk Mitigation: Identify technical, operational, and supply chain risks early; develop proactive mitigation plans and drive critical issues to closure.

• Standards & Audits: Ensure absolute compliance with ISO 9001, IATF 16949, customer specifications, and internal quality standards while supporting audits.

Requirements & Qualifications

Education & Experience

• Academic Background: Bachelor’s Degree or Diploma in Engineering (Mechanical, Electrical, Electronics, Materials, Manufacturing, or an equivalent technical field).

• Industry Experience: Proven track record in project management or NPI engineering within a semiconductor manufacturing or assembly environment.

• Valued Certifications: Project Management (PMP) or Lean Six Sigma certifications are considered strong advantages.

Technical Skills & Competencies

• Semiconductor Packaging: Familiarity with Leadframe/Substrate packaging (QFN, DFN, BGA, LGA, SiP), MEMS, Silicon Photonics, Flip Chip, Cu Pillar, Wire Bonding, and Encapsulation.

• Project & Change Management: Strong skills in project scheduling, Budget/CAPEX management, risk mitigation, and change control.

• Quality Methodologies: Solid understanding of Lean Manufacturing, Six Sigma, 8D, and Automotive Semiconductor Qualification processes.

Requirements:

Experience: Preferably with 3 years of hands-on experience in semiconductor assembly/packaging, specifically focusing on NPI or Project Management

Fresh graduates are encouraged to apply as well.