NPI Engineer: Semiconductor Assembly & PM Lead

Carsem

Ipoh

On-site

MYR 90,000 - 130,000

Full time

27 hours ago

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Job summary

Jora Malaysia is seeking an ambitious New Product Introduction (NPI) Executive to lead NPI, technology development, and manufacturing transfer across semiconductor assembly—from FOL to EOL. You will be the primary technical and project interface between customers, suppliers, manufacturing, and internal teams, driving planning, readiness, and on-time releases.

Applicants should have a Bachelor’s or Diploma in Engineering with a minimum of 3 years in semiconductor packaging/NPI or project

Qualifications

Bachelor’s Degree or Diploma in Engineering or equivalent technical field.
3 years of hands-on experience in semiconductor assembly/packaging with NPI or PM focus.
PMP or Lean Six Sigma certifications are advantageous.
Strong cross-functional and customer-facing interface capabilities.

Responsibilities

End-to-End Leadership: Lead cross-functional NPI projects from kick-off to mass production release.
Project Planning: Develop and maintain detailed schedules, milestones, risk registers, and contingency plans.
Performance Monitoring: Track progress against timelines, budgets, quality standards, and milestones.
Lifecycle Management: Manage NPI from feasibility through qualification, builds, and ramp.
Customer & Stakeholder Management: Interface with customers and suppliers, lead reviews, and manage ECO/ECR.