Senior Molding Engineer — Semiconductor Back-End Innovation

Nexperia Germany GmbH; Seremban; On-site; MYR 60,000 - 90,000; Full time

Job summary

Nexperia is seeking an experienced engineer to develop, characterize, and sustain backend molding processes for high-volume semiconductor manufacturing in Malaysia. You will lead process performance, yield, and equipment reliability while guiding cross-functional teams on molding topics.

The role requires expertise in molding tooling, Six Sigma, DOE, FMEA, and 8D with a focus on process qualification and ramp-up to high-volume production.

Qualifications

• Solid understanding of backend assembly molding processes, including compound flow, curing behavior, and defect mechanisms.
• Bachelor's degree in Engineering or related technical discipline is required.
• Knowledge of molding compound properties, interactions, and material behavior is essential.

Responsibilities

• Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
• Act as technical owner for molding process performance, yield, and equipment stability in production.
• Provide technical leadership and guidance on molding-related topics within cross-functional project teams.
• Support new product introduction (NPI), process qualification, and ramp-up into high-volume manufacturing.
• Drive continuous improvement to enhance yield, quality, reliability, UPH, and cost efficiency.
• Identify molding process integration risks and define mitigation plans using structured engineering methods.
• Troubleshoot and resolve molding-related issues involving compound behavior, tooling, equipment, and system interactions.
• Collaborate with Process, Equipment, QA, R&D, NPI, Product Design, and Reliability teams.
• Support molding compound selection, evaluation, and change management, ensuring stable manufacturability.
• Maintain SOPs, process specifications, control plans, FMEAs, and technical reports.
• Contribute to technology and package roadmaps through benchmarking, studies, and data-driven recommendations.
• Provide technical support to internal stakeholders and external customers when required.
• Perform effectively in a fast-paced, high-volume manufacturing environment.

Skills

Molding tooling

Six Sigma

DOE

FMEA

8D

Education

Bachelor's degree in Engineering

Tools

Lauffer molding systems

Job description

Nexperia is seeking an experienced engineer to develop, characterize, and sustain backend molding processes for high-volume semiconductor manufacturing in Malaysia. You will lead process performance, yield, and equipment reliability while guiding cross-functional teams on molding topics.

The role requires expertise in molding tooling, Six Sigma, DOE, FMEA, and 8D with a focus on process qualification and ramp-up to high-volume production.