Lead Molding Engineer for High-Volume Semiconductors
Nexperia
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Job summary
Nexperia in Malaysia seeks a Senior Engineer (Molding) to lead reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor environment. You will collaborate with Process Engineering, R&D, NPI, and Product Design to support new product introductions and advanced packaging technologies.
Key duties include leading maintenance, conducting MTBF/MTBA analysis, ensuring readiness for HVM, maintaining documentation, planning 24/7 staffing, mentoring
Qualifications
- Bachelor's degree in engineering or a related technical field.
- Minimum 5 years of experience in the semiconductor industry, with at least 5 years specializing in EMC molding equipment or processes.
- Strong problem-solving, communication, and cross-functional collaboration skills.
Responsibilities
- Lead maintenance and continuous improvement of molding equipment across package types.
- Monitor downtime and perform MTBF/MTBA analysis to drive improvements.
- Ensure equipment readiness for high-volume manufacturing during new product introductions and qualification.
- Maintain technical documentation, including control plans, process specs, SOPs, FMEAs, and reports.
- Plan and manage technician headcount for 24/7 operations; provide clear updates to stakeholders.
- Mentor technicians and set KPI targets; conduct annual performance reviews.
- Collaborate with R&D, NPI, Product Design, and Reliability to align capability with requirements.
- Diagnose and resolve molding-related issues impacting yield and reliability.
- Support technology transfer and ramp-up to HVM; contribute to roadmaps for advanced packaging.
Skills
Education
Tools
Job description
Nexperia in Malaysia seeks a Senior Engineer (Molding) to lead reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor environment. You will collaborate with Process Engineering, R&D, NPI, and Product Design to support new product introductions and advanced packaging technologies.
Key duties include leading maintenance, conducting MTBF/MTBA analysis, ensuring readiness for HVM, maintaining documentation, planning 24/7 staffing, mentoring
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