Senior Equipment & Process Engineer (Molding)

Nexperia; Seremban; On-site; MYR 180,000 - 260,000; Full time

Job summary

Nexperia in Malaysia seeks a Senior Engineer (Molding) to lead reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor environment. You will collaborate with Process Engineering, R&D, NPI, and Product Design to support new product introductions and advanced packaging technologies.

Key duties include leading maintenance, conducting MTBF/MTBA analysis, ensuring readiness for HVM, maintaining documentation, planning 24/7 staffing, mentoring

Qualifications

• Bachelor's degree in engineering or a related technical field.
• Minimum 5 years of experience in the semiconductor industry, with at least 5 years specializing in EMC molding equipment or processes.
• Strong problem-solving, communication, and cross-functional collaboration skills.

Responsibilities

• Lead maintenance and continuous improvement of molding equipment across package types.
• Monitor downtime and perform MTBF/MTBA analysis to drive improvements.
• Ensure equipment readiness for high-volume manufacturing during new product introductions and qualification.
• Maintain technical documentation, including control plans, process specs, SOPs, FMEAs, and reports.
• Plan and manage technician headcount for 24/7 operations; provide clear updates to stakeholders.
• Mentor technicians and set KPI targets; conduct annual performance reviews.
• Collaborate with R&D, NPI, Product Design, and Reliability to align capability with requirements.
• Diagnose and resolve molding-related issues impacting yield and reliability.
• Support technology transfer and ramp-up to HVM; contribute to roadmaps for advanced packaging.

Skills

Molding equipment

Maintenance leadership

Downtime analysis

Statistical tools

Documentation

Education

Bachelor's degree in engineering

Tools

JMP

Minitab

Job description

About the Role

As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.

What You Will Do

• Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
• Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
• Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
• Collaborate with cross-functional teams to develop, maintain, and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports.
• Plan and manage technician headcount to support 24/7 manufacturing operations; delegate tasks efficiently and provide clear, transparent updates to stakeholders.
• Mentor and coach technicians to strengthen technical competency and engineering mindset, including KPI setting and annual performance reviews.
• Work closely with R&D, NPI, Product Design, and Reliability teams to align molding equipment capability with package architecture and process requirements.
• Diagnose and resolve molding-related equipment and process issues impacting yield and reliability.
• Support technology, process, and equipment transfer activities and ensure smooth ramp-up to HVM.
• Contribute to process technology roadmaps for advanced packaging, thin form factor solutions, and emerging device architectures.
• Drive continuous improvement initiatives such as MVA, yield improvement, and UPH optimization.
• Manage spare parts inventory, procurement activities, and vendor engagement.
• Liaise with suppliers and vendors for jig and fixture fabrication and closely monitor delivery schedules for spare and non-spare parts.

What You Will Need

• Bachelor’s degree in engineering or a related technical discipline.
• Minimum 5 years of experience in the semiconductor industry, with at least 5 years specializing in EMC molding equipment or processes.
• Strong hands-on experience with compression or transfer molding, including thin flat mold, exposed pad, and multi-die packages.
• Proficiency in statistical analysis tools such as JMP and Minitab, with solid technical documentation skills.
• Strong understanding of mold compound properties, material flow behavior, curing characteristics, and interactions with other assembly materials (added advantage).
• Proven leadership skills with experience managing technicians in a 24/7 manufacturing environment.
• Excellent problem-solving, communication, and cross-functional collaboration skills.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better.

We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games.

Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups.

Nexperia is committed to increasing women in management positions to 30% by 2030.

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 12,000+ strong international network with a singular focus.

Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face.

We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Looking to push boundaries in a company where your talents can shine?