Lead Manufacturing Process Engineer | PCB & NPI

Celestica Inc.; Kulai; On-site; MYR 180,000 - 240,000; Full time

Job summary

Celestica Inc. is seeking a Lead Engineer, Manufacturing Process in Senai, Johor, Malaysia. The role focuses on designing, deploying, and optimizing PCB assembly processes to meet quality, cost, and delivery targets.

You will drive production data preparation, routing accuracy in SAP and SP2, and manufacturing instructions. Responsibilities include launching new products, coordinating with cross-functional teams, and ensuring changes are properly documented.

Qualifications

• Bachelor degree in Electrical/Electronics/Mechanical Engineering.
• 8–10 years EMS industry experience.
• ISO procedures knowledge.
• Strong data analysis and problem-solving skills.

Responsibilities

• Prepare and optimize production data for PCB Assembly.
• Create and maintain detailed production routings in SAP and Spectrum Pro (SP2).
• Develop PCB assembly instructions considering production capabilities.
• Manage stencil optimization and inventory for timely delivery.
• Oversee new product launches and coordinate with cross-functional teams.
• Manage product changes and version control.

Skills

Process optimization

Data analysis

SAP

Spectrum Pro (SP2)

NPI

DFM

Quality systems

Team leadership

Education

Bachelor degree in Electrical/Electronics/Mechanical Engineering

Tools

SAP

Spectrum Pro (SP2)

Job description

Celestica Inc. is seeking a Lead Engineer, Manufacturing Process in Senai, Johor, Malaysia. The role focuses on designing, deploying, and optimizing PCB assembly processes to meet quality, cost, and delivery targets.

You will drive production data preparation, routing accuracy in SAP and SP2, and manufacturing instructions. Responsibilities include launching new products, coordinating with cross-functional teams, and ensuring changes are properly documented.