Global Thermal & Mechanical Programs Manager

AMD; George Town; Hybrid; MYR 180,000 - 300,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD Penang, Malaysia, seeks an experienced engineering leader to drive thermal, mechanical and board-assembly programs from requirements through qualification to production ramp. You will connect package, board, cooling and chassis integration, ensuring supplier deliverables align with the product schedule and travel to supplier sites as needed.

The role requires broad technical depth, decisiveness across global teams, and clear communication with engineers and executives.

Qualifications

• Experience in thermal/mechanical hardware or electronics NPI.
• Delivery from engineering development through qualification and production ramp.
• Experience with SMT processes and large BGA assembly challenges is advantageous.
• Understanding of package-to-system heat path, TIMs and reliability qualification is advantageous.
• Experience with cooling suppliers, CMs, ODMs or OSATs, preferably in APAC.
• DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.
• Proficient in English, technical writing and executive communication skills.

Responsibilities

• Define program scope, milestones, owners and acceptance criteria; build integrated schedules and manage critical paths, resources and budgets.
• Coordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements; assess impact of design changes.
• Lead execution reviews with cooling suppliers, CMs, ODMs and OSATs; track specs, samples, tooling, capacity, quality and recovery actions.
• Plan engineering and validation builds and drive evidence-based entry/exit decisions at milestones.
• Coordinate program deliverables for advanced SMT and large BGA assembly; manage process windows and warpage mitigation.
• Manage risks, issues, dependencies and engineering changes; present recovery options with schedule, cost and qualification impact.
• Drive DFM/DFA reviews, release docs, manufacturing handover and ramp issue closure.

Skills

Cross-functional program management

Engineering coordination

DOE & FMEA

Executive communication

Technical writing

PMP (advantageous)

Education

Bachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering

Tools

Power BI

SQL

Python

Job description

AMD Penang, Malaysia, seeks an experienced engineering leader to drive thermal, mechanical and board-assembly programs from requirements through qualification to production ramp. You will connect package, board, cooling and chassis integration, ensuring supplier deliverables align with the product schedule and travel to supplier sites as needed.

The role requires broad technical depth, decisiveness across global teams, and clear communication with engineers and executives.