Equipment Sr Technician/Associate Engineer (Grinding/Dicing/LLO/Bonding)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

Kulim

On-site

MYR 67,000 - 100,000

Full time

6 days ago
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Job summary

ams OSRAM in Kulim, Malaysia is seeking an Equipment Senior Technician/Associate Engineer to support grinding, dicing, LLO and bonding processes on the factory floor.

You'll implement hardware solutions, perform maintenance, calibration, and troubleshooting of FE machines, and help ensure production availability of tools and parts, collaborating with process engineers to improve operations.

Qualifications

  • Min. Diploma or equivalent qualification in engineering.
  • Min 5 years experience in manufacturing environment and maintenance engineering.
  • Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
  • Able to communicate in English and Bahasa Malaysia.

Responsibilities

  • Implements hardware solutions for grinding/dicing/LLO/Bonding processes and maintains, enhances, troubleshoots, and supports existing tools.
  • Performs troubleshooting and repair of FE machines such as dicing, grinding, LLO, and bonding sub-tools used in FE production.
  • Carries out calibration and preventive maintenance on machines and equipment.
  • Ensures availability of materials and spare parts; maintains records of maintenance programs.
  • Supports process engineers and carries out project work to improve production operations.
  • Documents production equipment and handover instructions from Engineering to Operations.

Skills

Maintenance engineering
Grinding process
Dicing process
LLO/Bonding process
Communication in English & Bahasa-Mal

Education

Diploma in Engineering

Job description

Equipment Sr Technician/Associate Engineer (Grinding/Dicing/LLO/Bonding) Kulim, Malaysia

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities
  • To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
  • Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
  • Carry out calibration/ preventive maintenance to the machine and equipment.
  • Ensure the availability of materials and spare parts.Maintains records of daily, monthly and yearly maintenance programs.
  • Performs other project related to improve production operation. Assist process engineer to carry out evaluation
  • Document production equipment and assembly work instruction to hand off from Engineering to Operations

What we look for

  • Min. Diploma or equivalent qualification in engineering.
  • Min 5 years experience in manufacturing environment and maintenance engineering.
  • Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
  • Able to communicate in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM .

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.

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