Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)

Ams Osram; Malaysia; On-site; MYR 40,000 - 70,000; Full time

Job summary

A leading semiconductor firm in Malaysia is seeking a skilled maintenance engineer to implement and maintain hardware solutions for critical manufacturing processes. The role requires at least 5 years of experience in a manufacturing environment, focusing on troubleshooting and preventive maintenance of specialized equipment like dicing and grinding machines. Proficiency in English and Bahasa Malaysia is essential. Successful candidates will ensure optimal production operations and assist in process evaluations.

Qualifications

• Minimum 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding, dicing, LLO, Bonding process.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.

Responsibilities

• Implement hardware solutions for grinding, dicing, LLO, Bonding process.
• Troubleshoot and repair FE machines used in production.
• Carry out calibration and preventive maintenance of machines.
• Carry out calibration/ preventive maintenance to the machine and equipment.
• Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
• Performs other project related to improve production operation. Assist process engineer to carry out evaluation
• Document production equipment and assembly work instruction to hand off from Engineering to Operations

Skills

Troubleshooting

Preventive maintenance

Communication in English

Communication in Bahasa Malaysia

Education

High school diploma or equivalent

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

• To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
• Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
• Carry out calibration/ preventive maintenance to the machine and equipment.
• Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
• Performs other project related to improve production operation. Assist process engineer to carry out evaluation
• Document production equipment and assembly work instruction to hand off from Engineering to Operations

Qualifications

• High school diploma or equivalent qualification.
• Min 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.