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AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK (MALAYSIA) SDN. BHD. seeks an engineer to manage equipment qualification and supplier relations for the Kulim expansion, ensuring specs are met from machine manufacturing through site delivery.
You will lead DOE, sample sizing, lab support, and quality alignment with global teams. Ideal candidate has a technical degree and 3+ years in semiconductor or related patterning/process areas, with strong English, willingness to travel, and ability to work across
Ensure the Kulim expansion project all tools pass the qualification on time.
Capex avoidance and run rate improvement to lower the running cost.
Technical transfer and training for the local employee.
Managing equipment suppliers to meet official agreement of Spec on Web requirement - machine manufacturing and after machine delivery to AT&S sites.
Defining and executing equipment qualification requirement which includes DOE, IPP sample size, lab/rel support requirement, etc.
Supporting global purchasing team in PoN from technical standpoint (gate of balancing price and functionality + capability).
Ensuring non-CE equipment can meet Customers’ requirements (quality & stability) and match or exceed production baseline within 6 months after releasing to HVM.
Ensure all updated documents which are related to non-CE tools released in quality documentation system prior to tool release to HVM.
Support in establishing new algorithm of materials consumption of equipment together with supplier & process team. Incorporate into existing planning and purchasing system (include POR materials and non POR materials if any).
Managing equipment suppliers to meet official agreement of Spec on Web requirement - machine manufacturing and after machine delivery to AT&S sites.
Providing all facilities, PUT & EHS related information prior to machine move in.
Meeting all committed timelines of each key milestone such as specification finalization, supplier selection, tools qualification, initial and final ramp up plan (volume and quality).
Documentation of all key learnings and best-known method (BKM) of sourcing inspection to ensure machine conditions are meeting quality, functionality, clean room requirement, etc. before machine move in production floor.
Capex avoidance and run rate improvement.
Bachelor’s degree in chemical engineering, Chemistry, Materials Science, Physics, Electronics or a comparable technical discipline.
Minimum 3 years of relevant experience in semiconductor, IC-substrate, advanced-packaging surface preparation, dielectric processing, plasma cleaning/descum or related patterning processes.
Experience in working with intercultural teams is preferred.
Preferably from the substrate industry or familiar with the following process:
Knowledge of project management, data evaluation and design of experiments.
Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP ,etc.
Good analytical skills with attention to details.
Good stress management skills.
Process engineering’s experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry.
Fluent written and oral English (Mandarin would be of advantage).
Willingness to travel and stay abroad for a certain time in one or our locations.
Open-minded approach.
Good team working spirit and leadership skills.
Good communication and negotiation skills.
AT&S is a globally leading manufacturer of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive, Industrial and Medical. AT&S has its headquarters in Austria and global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). A new high-end production site for IC substrates is currently being established in Kulim, Malaysia. In Leoben, a European competence centre including series production is being built. The company employs roughly 15,000 people. For further information please visit www.ats.net
AT&S is a globally leading manufacturer of high-end printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive, Industrial and Medical. AT&S has its headquarters in Austria and global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). A new high-end production site for IC substrates is currently being established in Kulim, Malaysia. In Leoben, a European competence centre including series production is being built. The company employs roughly 15,000 people. For further information please visit www.ats.net