Engineering Head WBG (Back-End Tooling)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 420,000 - 660,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Car subsidy

Job summary

Carsem is seeking an Engineering Head for WBG to lead the back end tooling function, oversee tooling performance, availability, and cost across the back end assembly process. The role builds and guides an engineering team to keep WBG lines running at target yield and output.

Responsibilities include driving uptime, cost reduction, supplier development, and ensuring quality systems compliance. The ideal candidate has deep hands-on tooling experience and 5+ years of leadership in a high-volume

Qualifications

• Back end tooling expertise and lifecycle understanding for back end assembly processes.
• Experience in tooling design support, maintenance and cost reduction.
• Vendor management and qualification with customer-ready documentation.
• Familiarity with ISO/TS 16949, ISO 9001 and related quality systems.

Responsibilities

• Own tooling strategy, design support and lifecycle management for back end assembly processes.
• Drive tooling uptime, preventive maintenance and refurbishment programs to reduce downtime.
• Lead tooling cost reduction, in house capability building and supplier development.
• Qualify new tooling and vendors per customer and package requirements.
• Lead and develop the engineering team and set clear targets across tooling, process and equipment.

Skills

Back end tooling

Tooling design support

Maintenance management

Vendor management

Root cause analysis

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing or Materials Engineering

Master's degree preferred

Job description

The Engineering Head for WBG leads the engineering function with back end tooling as the core expertise. The role owns tooling performance, availability and cost across the back end assembly process, and builds an engineering team that keeps WBG lines running at target yield and output.

Key Responsibilities:

Back end tooling

Own tooling strategy, design support and lifecycle management for back end assembly processes, including mold, trim and form, singulation and related change kits and consumables.

Drive tooling uptime, preventive maintenance and refurbishment programs to reduce downtime and unplanned changeovers.

Lead tooling cost reduction, in house capability building and local supplier development.

Qualify new tooling and vendors in line with customer and package requirements.

Engineering leadership

Lead, coach and develop the engineering team, including succession for critical technical roles.

Set priorities and clear targets across tooling, process and equipment engineering teams.

Partner with Operations, Quality, NPI and Maintenance to support new package introductions and ramp up.

Quality, yield and compliance

Resolve tooling related yield loss, defects and customer complaints through structured root cause and corrective action.

Maintain compliance with customer audits, quality systems and safety standards.

Drive continuous improvement and automation initiatives to lift output and reduce cost per unit.

Management and reporting

Manage the engineering budget and capital requests for tooling.

Report performance to the General Manager, WBG and Carsem senior management.

Requirements

Experience

Around 12 or more years in semiconductor back end assembly engineering, with deep hands on expertise in back end tooling.

At least 5 years leading engineering teams, ideally at manager or senior manager level.

Proven track record in tooling design support, maintenance, cost reduction and vendor management in an OSAT or comparable high volume environment.

Experience with customer audits and quality systems such as IATF 16949 and ISO 9001.

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing or Materials Engineering or a related field. Master's degree preferred.

Strong knowledge of back end processes and package types, and how tooling affects yield, quality and cycle time.

Working knowledge of lean, Six Sigma, SPC and structured problem solving methods.

Exposure to automation and Industry 4.0 initiatives is an advantage.

Hands on technical leadership with the credibility to guide engineers and technicians on the shop floor.

Strong ownership and urgency, able to stabilise the function quickly.

Clear communication with the General Manager, customers and cross functional peers.

Product & Services

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

Medical Education support Dental Parking Medical for immediate family members, car subsidy

Researching careers? Find all the information and tips you need on career advice.