End-of-Line (EOL) Process Engineer

Carsem (M) Sdn. Bhd; Ipoh; Presencial; MYR 67.000 - 112.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical

Dental

Car subsidy

Descripción de la vacante

Carsem (M) Sdn. Bhd is seeking a driven engineer for our Ipoh-based semiconductor manufacturing site.

The role focuses on process improvement and yield enhancement across EOL processes such as mold, laser marking, trim & form, and singulation, with emphasis on root cause analysis and FMEA. You will support customer audits, ensure documentation readiness, and manage process specifications while driving cost-saving initiatives and cross-functional collaboration.

Formación

• Bachelor’s degree in engineering (Mechanical, Electrical, Mechatronics, or related)
• 2–5 years of experience in semiconductor/manufacturing
• Hands-on in EOL processes (mold, laser marking, trim & form, singulation, auto vision)
• Strong problem-solving and analytical skills (root cause analysis, FMEA)
• Good communication skills for customer audits/visits
• Ability to work in a fast-paced, team-oriented environment

Responsabilidades

• Drive continuous improvement to enhance EOL yield, quality, and productivity
• Support customer audits and production line visits; prepare and deliver process flow presentations
• Manage FMEA and process specifications; keep documentation up-to-date
• Lead cost-saving initiatives through process optimization and material changes; mentor technicians and align with operations

Conocimientos

Process Improvement

Yield Enhancement

Root Cause Analysis

FMEA

Customer Engagement

Teamwork

Educación

Bachelor's Degree in Engineering

Descripción del empleo

Key Responsibilities

• 1. Process Improvement & Yield Enhancement
  • Drive continuous improvement initiatives to enhance EOL yield, quality, and productivity
  • Focus on critical EOL processes such as molding, marking, trim & form, singulation, and auto vision
  • Identify root causes of process issues and implement effective corrective actions
• 2. Customer Audit & Engagement
  • Support customer audits and production line visits
  • Prepare and deliver presentations on process flow and qualification activities
  • Ensure readiness of documentation and compliance with customer requirements
• 3. FMEA & Process Specification Management
  • Perform periodic reviews and updates of FMEA and process specifications
  • Ensure process documentation is accurate, up-to-date, and aligned with operational standards
• 4. Cost Saving Initiatives
  • Initiate and implement cost reduction activities through process optimization and material changes
  • Collaborate with cross-functional teams to achieve departmental cost-saving targets
  • Mentor and guide process technicians on the production floor
  • Align daily activities with the operations team to ensure smooth production flow
  • Provide technical support and troubleshooting assistance

Requirements

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Mechatronics, or related field)
• Minimum 2–5 years of experience in semiconductor or manufacturing environment
• Hands-on experience in EOL processes (mold, laser marking, trim & form, singulation, auto vision)
• Strong problem-solving and analytical skills (e.g., root cause analysis, FMEA)
• Good communication skills with ability to engage customers during audits/visits
• Ability to work in a fast-paced and team-oriented environment

Perks and benefits

• Medical Education support Dental Parking Medical for immediate family members, car subsidy

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).