Die Prep Module Engineer (Contract)

Intel Corporation; Kulim; On-site; MYR 120,000 - 180,000; Part time

Job summary

Intel Corporation in Kulim, Malaysia seeks a Die Prep Module Engineer focused on Advanced Metrology. You will own metrology tool performance, drive troubleshooting, and improve uptime and process control in a high-volume manufacturing environment.

Join a team delivering advanced packaging solutions, collaborating across Process Engineering, Manufacturing, Automation, and suppliers to deploy new technologies and ramps while maintaining detailed operating procedures and documentation.

Qualifications

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, or a related field.
• Knowledge of semiconductor manufacturing processes, preferably in Die Prep/metrology/advanced packaging.
• Experience with SPC, DOE, and FMEA.
• Strong troubleshooting and data-driven problem solving.

Responsibilities

• Own the performance, reliability, and capability of advanced metrology and inspection equipment within the Die Prep module.
• Drive equipment troubleshooting, root cause analysis, and resolution of hardware, software, and automation-related issues.
• Improve tool uptime, productivity, and reliability through preventive maintenance and continuous improvement initiatives.
• Utilize SPC, DOE, FMEA, and data analysis to identify trends and prevent process excursions.
• Partner with Process Engineering, Manufacturing, Automation, and suppliers to support technology transfers, NPI, and ramps.
• Develop and optimize metrology recipes to meet process control and manufacturing requirements.
• Lead equipment installation, qualification, upgrades, and capacity expansion projects.
• Develop and maintain operating procedures, maintenance standards, and troubleshooting documentation.
• Identify and implement innovative metrology and automation solutions to improve yield and factory performance.

Skills

Metrology expertise

Troubleshooting

Data analysis

Cross-functional collaboration

Education

Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or related field

Job description

Job Details:

Job Description:

The Role and Impact As a Die Prep Module Engineer specializing in Advanced Metrology, you will own the performance, capability, and reliability of critical metrology and inspection tools in Intel’s manufacturing environment. You will drive equipment optimization, troubleshooting, and technology deployment to improve measurement accuracy, process control, and operational efficiency. Working closely with Process Engineering, Manufacturing, Automation, and suppliers, you will solve complex technical challenges and enable high-volume manufacturing success. Your work will directly support product quality, factory productivity, and Intel’s advanced packaging roadmap. Business Group As part of Intel’s Wafer Packaging Manufacturing (WPM) organization, you will join a team focused on advancing semiconductor packaging technologies and manufacturing excellence. The Die Prep Module Engineering team develops and sustains metrology and inspection solutions that enable process control, product quality, and efficient manufacturing. In this collaborative environment, you will work with cross-functional teams to deploy new technologies, improve equipment performance, and support factory operations and future technology ramps.

Key Responsibilities

• Own the performance, reliability, and capability of advanced metrology and inspection equipment within the Die Prep module.
• Drive equipment troubleshooting, root cause analysis, and resolution of hardware, software, and automation-related issues.
• Improve tool uptime, productivity, and reliability through preventive maintenance and continuous improvement initiatives.
• Utilize SPC, DOE, FMEA, and data analysis to identify trends, improve measurement capability, and prevent process excursions.
• Partner with Process Engineering, Manufacturing, Automation, and suppliers to support technology transfers, NPI, and manufacturing ramps.
• Develop and optimize metrology recipes to meet process control and manufacturing requirements.
• Lead equipment installation, qualification, upgrades, and capacity expansion projects.
• Develop and maintain operating procedures, maintenance standards, and troubleshooting documentation.
• Identify and implement innovative metrology and automation solutions to improve yield, quality, and factory performance.

Qualifications

Minimum Qualifications

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or a related field.
• Knowledge of semiconductor manufacturing processes, preferably in Die Prep, metrology, or advanced packaging.
• Experience with statistical and problem-solving methodologies such as SPC, DOE, and FMEA.
• Strong troubleshooting and analytical skills with the ability to diagnose equipment and process issues using data-driven approaches.

Preferred Qualifications

• Experience supporting metrology, inspection, or semiconductor manufacturing equipment in a high-volume production environment.
• Demonstrated success in equipment performance improvement, process optimization, or yield enhancement initiatives.
• Knowledge of Root Cause Analysis (RCA), process control, and manufacturing data analytics.
• Strong communication and collaboration skills with the ability to work effectively across cross-functional teams and external suppliers.
• Self-motivated with a passion for innovation, continuous improvement, and manufacturing excellence.

We are seeking motivated engineers who are passionate about solving complex technical challenges and driving manufacturing innovation.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.