Die Prep MES Engineer - Project to Production

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 60,000 - 90,000; Full time

Job summary

TI is recruiting an Equipment Engineer to lead the MES rollout for Die Prep equipment, driving the digital transformation and then transitioning to production to optimize uptime and automation in a high-volume setting.

The role requires hands-on Die Prep/Dicing equipment experience, strong data analysis and collaboration across functions, with a focus on reliability and MES-driven improvements.

Qualifications

• Bachelor's degree in an engineering field (Electrical, Electrical/Computer, Chemical, Mechanical, Materials Science, Physics) or related discipline.
• 2+ years hands-on semiconductor Die Prep/Dicing equipment experience.

Responsibilities

• MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
• Integration & Data: Translate Die Prep hardware requirements into digital designs. Define data collection points for equipment health and interlock logic.
• Validation: Validate integration scenarios and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Skills

Die Prep equipment

MES knowledge

Data analysis

Project coordination

Communication skills

Education

Bachelor's degree

Job description

TI is recruiting an Equipment Engineer to lead the MES rollout for Die Prep equipment, driving the digital transformation and then transitioning to production to optimize uptime and automation in a high-volume setting.

The role requires hands-on Die Prep/Dicing equipment experience, strong data analysis and collaboration across functions, with a focus on reliability and MES-driven improvements.