CQE QA Engineer
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem is seeking a Quality Assurance Engineer at its Ipoh, Malaysia site to act as the main interface for customer quality issues, oversee VOC/VOP matters, and coordinate cross-functional teams to resolve concerns. You will lead containment, perform root-cause analysis, manage CAPA and FA/RMA activities, and support customer audits while ensuring IATF 16949 compliance.
The role requires a Bachelor’s degree in Engineering, Science, or a related discipline, with 3–5 years of experience preferred.
Qualifications
- Bachelor's degree in Engineering, Science or related discipline.
- Preferably 3–5 years of experience; freshers encouraged to apply.
- Strong experience in customer complaint management and structured problem solving.
- Detailed understanding of 8D analysis.
- Good understanding of IATF 16949 and/or VDA 6.3 requirements.
- Experience in semiconductor assembly and packaging is preferred.
Responsibilities
- Act as the key interface with customers on quality-related complaints and VOC/VOP matters.
- Coordinate with internal teams to assess and resolve customer quality concerns.
- Lead containment activities and risk assessments to minimize impact of quality issues.
- Communicate effectively with customers throughout the resolution process.
- Perform root cause analysis and drive CAPA implementation.
- Coordinate Failure Analysis activities and manage RMA processes.
- Support customer audits and follow-up on findings.
- Ensure compliance with IATF 16949 and related quality standards.
- Prepare quality reports for management review.
- Contribute to continuous improvement and quality documentation.
Skills
Education
Job description
Act as the key interface with customers on quality-related complaints and issues, including Voice of Customer (VOC) and Voice of Process (VOP) matters.
Coordinate with relevant internal teams to understand, assess, and resolve customer quality concerns.
Lead containment activities and risk assessments to minimize the impact of quality issues.
Ensure timely and effective communication with customers throughout the complaint resolution process.
2. Root Cause Analysis & CAPA
Coordinate cross-functional teams to conduct structured root cause analysis for customer complaints and quality issues.
Drive the development and implementation of effective Corrective and Preventive Actions (CAPA).
Ensure corrective actions address the root cause and are sustainable to prevent recurrence.
Follow up on action plans and monitor their effectiveness until formal closure.
3. Failure Analysis & Customer RMA
Coordinate and follow up on Failure Analysis (FA) activities and submission to customers.
Manage customer Return Material Authorization (RMA) activities and ensure timely follow-up with relevant internal teams.
Review and consolidate technical findings and supporting information for customer submission.
4. Customer & Internal Audit
Support and coordinate customer audits, including preparation, audit execution, and follow-up on findings.
Work with relevant functions to ensure customer audit findings are addressed within the agreed timeline.
Conduct internal audits to verify the effectiveness and closure of CAPA.
Ensure quality activities and processes are aligned with applicable IATF 16949 requirements.
5. Quality Reporting & Management Review
Prepare and consolidate quality-related reports for management review.
Analyse customer complaints, quality trends, and recurring issues to identify areas requiring improvement.
Provide relevant quality data and recommendations to management and stakeholders.
6. Quality System & Continuous Improvement
Support the implementation and maintenance of quality management system requirements.
Participate in continuous improvement initiatives to strengthen process quality and reduce recurring quality issues.
Ensure appropriate quality documentation and records are maintained.
7. Cross-Functional Collaboration
Work closely with Process Engineering, Manufacturing, Quality, Reliability, and other relevant functions to resolve customer and process-related quality issues.
Provide technical input and quality guidance during problem-solving and improvement activities.
Support other quality-related activities or projects as assigned by the QA Manager.
Bachelor's Degree in Engineering, Science, or a related discipline.
Preferably 3-5 years of experience, fresher is encouraged to apply
Strong experience in customer complaint management and structured problem-solving.
Detailed understanding and hands‑on experience in 8D analysis.
Good understanding of IATF 16949 and/or VDA 6.3 requirements.
Experience in semiconductor assembly and packaging is preferred.
Experience in handling customer audits and quality-related customer engagements would be an advantage.
Failure Mode and Effects Analysis (FMEA)
Statistical Process Control (SPC)
8D Problem Solving
Control Plans
Reliability and quality systems
ISO 9001
IATF 16949 / ISO/TS 16949
Semiconductor assembly and test flow
Semiconductor packaging and manufacturing processes
Customer complaint and CAPA management
Hirer responsiveness Salary match Number of applicants
Your application will include the following questions:
- Which of the following statements best describes your right to work in Malaysia?
- What's your expected monthly basic salary?
- How many years' experience do you have as a Quality Assurance Engineer?
- Which of the following types of qualifications do you have?
- Have you worked in a role which requires a sound understanding of ISO 9001?
- Which of these industries have you worked in?
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
What can I earn as a Quality Assurance Engineer
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