BGA FE Wire Path cleaning operator

NXP Semiconductors; Kuala Lumpur; On-site; MYR 67,000 - 112,000; Full time

Job summary

NXP Semiconductors is seeking a dedicated team member to support wire bond path and window clamp cleaning activities in our manufacturing operations in Kuala Lumpur. This entry-level role focuses on maintaining process cleanliness and supporting yield improvement while adhering to safety and quality standards.

You will work with a global team and contribute to delivering high-quality, reliable semiconductor products.

Job description

Support on wire bond wire path and window clamp cleaning activity.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP.