BGA WB Yield & Process Engineer

NXP Malaysia Sdn Bhd; Petaling Jaya; On-site; MYR 60,000 - 90,000; Full time

Job summary

NXP Malaysia Sdn Bhd is seeking an engineer to drive yield improvements for BGA devices and align WB LOH with company goals, ensuring on-time customer delivery. The role involves collaboration with the NPI team on WB recipes creation and verification for BGA packages, and supporting productivity and cost savings initiatives.

The candidate should hold a Bachelor or Master degree in Electronics or Mechanical Engineering and be willing to learn WB processes with hands-on experience on the machine.

Qualifications

• Knowledge of FMEA, control plan, SPC and DOE is advantageous.
• Hands-on experience with WB processes and machines is desired.
• Ability to work in a team and adapt to production environments.

Responsibilities

• Drive yield improvement for BGA devices.
• Align WB LOH with NXP goals and ensure on-time customer delivery.
• Collaborate with NPI team on WB recipes creation and verification for BGA packages.
• Support productivity improvements and cost savings.

Skills

FMEA

Control plan

SPC

DOE

Team player

Willingness to learn

Education

Bachelor/Master in Electronics or Mechanical Engineering

Job description

NXP Malaysia Sdn Bhd is seeking an engineer to drive yield improvements for BGA devices and align WB LOH with company goals, ensuring on-time customer delivery. The role involves collaboration with the NPI team on WB recipes creation and verification for BGA packages, and supporting productivity and cost savings initiatives.

The candidate should hold a Bachelor or Master degree in Electronics or Mechanical Engineering and be willing to learn WB processes with hands-on experience on the machine.