BGA WB Process Engineer

NXP Semiconductors; Selangor; On-site; MYR 50,000 - 84,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking a WB process engineer to drive yield improvement at BGA devices and align WB LOH with company goals. You will collaborate with cross‑functional teams to ensure on‑time delivery to customers and support productivity and cost savings initiatives.

The role requires strong engineering fundamentals in electronics or mechanical fields, familiarity with FMEA, DOE, SPC, control plans, and a hands‑on approach to working with WB equipment.

Qualifications

• FMEA, control plan, SPC, DOE, and process flow knowledge is advantageous.
• Bachelor/Master degree in Electronics or Mechanical Engineering is required.

Responsibilities

• Drive yield improvement at WB/BGA devices.
• Align WB LOH to NXP goals and ensure on-time customer delivery.
• Collaborate with NPI team to establish WB recipes creation and verification for BGA packages.
• Support productivity and cost savings initiatives.

Skills

FMEA

Control plan

SPC

DOE

Process flow

Team player

Education

Bachelor/Master in Electronics or Mechanical Engineering

Job description

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Drive yield improvement at the BGA devices assigned to him/her .

Drive WB LOH align to NXP Goal and meet customer on time delivery.

Work with NPI team to establish NPI products like WB recipes creation and verification for BGA packages

Support productivity and cost savings

Requirements

• Bachelor/Master degree in Electronics or Mechanical Engineering
• Good knowledge with FMEA, control plan, SPC, DOE, and process flow is an advantage
• Possesses good positive attitude and team player
• Willingness to learn in WB process with hands‑on to the machine