BGA Wafer-Back Process Engineer: Yield & NPI Impact

NXP Semiconductors; Kuala Lumpur; On-site; MYR 56,000 - 89,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking an Electronics/Mechanical Engineer to drive yield improvements for BGA devices and support WB process optimization.

You will collaborate with the NPI team to establish WB recipes and verification for BGA packages, participate in process control activities, and contribute to productivity and cost savings initiatives. This role emphasizes hands-on learning and teamwork.

Qualifications

• Bachelor/Master degree in Electronics or Mechanical Engineering.
• Good knowledge with FMEA, control plan, SPC, DOE, and process flow is an advantage.
• Possesses good positive attitude and team player.
• Willingness to learn in WB process with hands-on to the machine.

Responsibilities

• Drive yield improvement at the BGA devices assigned to him/her.
• Drive WB LOH align to NXP Goal and meet customer on time delivery.
• Work with NPI team to establish NPI products like WB recipes creation and verification for BGA packages
• Support productivity and cost savings

Skills

FMEA

Control plan

SPC

DOE

Process flow

Education

Electronics/Mechanical Eng (BSc/MSc)

Job description

NXP Semiconductors Malaysia is seeking an Electronics/Mechanical Engineer to drive yield improvements for BGA devices and support WB process optimization.

You will collaborate with the NPI team to establish WB recipes and verification for BGA packages, participate in process control activities, and contribute to productivity and cost savings initiatives. This role emphasizes hands-on learning and teamwork.