Senior High-Speed IO & DDR Test Engineer

QUALCOMM, Inc.

Tijuana

On-site

MXN 420,000 - 640,000

Full time

14 days+

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Job summary

QUALCOMM Semiconductores y Sistemas Avanzados de Baja California seeks a Post Silicon Engineer to lead test methodology development and characterization of High Speed SERDES interfaces (PCIe, USB3, UFS, DP, MIPI) and related LP‑DDR/PC‑DDR subsystems.

You will perform silicon bring‑up, debug power and signal integrity issues, coordinate with IC Design, Systems Engineering and Customer Engineering to resolve complex RMA problems, and analyze parametric data to optimize designs across conditions.

Qualifications

  • Experience with high-speed test and characterization of SERDES and interfaces.
  • Understanding of eye diagrams, jitter and signal integrity analysis.
  • Experience with DDR/LPDDR protocols is a plus.
  • Hands-on lab experience with test equipment and failure analysis.
  • Strong communication and documentation skills.

Responsibilities

  • Define and execute test methodologies for high-speed SERDES interfaces.
  • Characterize LP-DDR/PC-DDR subsystems and related IOs.
  • Lead first silicon bring-up and debug to qualify designs at external foundries.
  • Analyze parametric data and optimize design parameters under varying conditions.
  • Collaborate with IC Design, Systems Engineering, and Customer Engineering on issues and RMAs.

Skills

High Speed SerDes
DDR protocol knowledge
Lab equipment
Python/C# for test automation
English fluency
VLSI knowledge
Signal integrity
Debugging

Education

Bachelor's degree in Engineering, Computer Science, or related field
Master's degree in Electrical/Electronics Engineering, Computer Science, or related field
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field

Tools

J-BERT
Oscilloscopes
TDRs
VNAs

Job description

QUALCOMM Semiconductores y Sistemas Avanzados de Baja California seeks a Post Silicon Engineer to lead test methodology development and characterization of High Speed SERDES interfaces (PCIe, USB3, UFS, DP, MIPI) and related LP‑DDR/PC‑DDR subsystems.

You will perform silicon bring‑up, debug power and signal integrity issues, coordinate with IC Design, Systems Engineering and Customer Engineering to resolve complex RMA problems, and analyze parametric data to optimize designs across conditions.

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