PROCESS ENGINEER THT

GPV

Región Centro

Presencial

MXN 350.000 - 550.000

Jornada completa

hace 48 horas
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Descripción de la vacante

GPV is seeking an experienced THT Process Engineer to lead through-hole technology and soldering operations, including wave and selective soldering, while ensuring high-reliability joints and IPC standard conformance.

Responsibilities include optimizing soldering profiles, programming selective soldering, standardizing manual processes, and driving CAPA and continuous improvement. English proficiency required; automotive/aerospace/medical electronics experience is a plus.

Formación

  • Bachelor’s degree in Electrical, Electronics, Industrial, or Mechanical Engineering.
  • Minimum 5 years of THT process engineering experience in electronics manufacturing.
  • Advanced knowledge of IPC-A-610 and J-STD-001.
  • Strong knowledge of solder alloys and flux systems; thermal management.
  • Good command of English.

Responsabilidades

  • Lead wave soldering profile optimization (flux application, preheat, dwell time, conveyor speed).
  • Own selective soldering programming and nozzle optimization.
  • Standardize manual soldering operations and manage operator certification programs.
  • Reduce defects including solder bridges, insufficient fill, icicles, solder skips, blow holes.
  • Perform root cause analysis using cross-sections, microanalysis, and solder joint inspection techniques.
  • Develop and maintain work instructions and training materials aligned with IPC standards.
  • Drive CAPA implementation and continuous improvement projects.
  • Support tooling, fixture design, and automation upgrades.

Conocimientos

Soldering expertise
Process optimization
Root cause analysis
CAPA implementation
Training development
IPC standards knowledge
English language

Educación

Bachelor’s degree in Electrical/Electronics/Industrial/Mechanical Engineering

Herramientas

Fixture design tools
Automation equipment
Selective soldering programming

Descripción del empleo

THT & Soldering is responsible for leading Through-Hole Technology (THT) and soldering operations, including wave, selective, and manual soldering processes. Based on benchmarking of more than 30 comparable industry job descriptions, this role demands deep expertise in solder metallurgy, flux chemistry, thermal dynamics, and high-reliability solder joint formation.

  • Lead optimization of wave soldering profiles including flux application, preheat configuration, dwell time, and conveyor speed.
  • Own selective soldering programming and nozzle optimization.
  • Standardize manual soldering operations and manage operator certification programs.
  • Reduce defects including solder bridges, insufficient fill, icicles, solder skips, and blow holes.
  • Perform root cause analysis using cross-sections, microanalysis, and solder joint inspection techniques.
  • Develop and maintain work instructions and training materials aligned with IPC standards.
  • Drive CAPA implementation and continuous improvement projects.
  • Support tooling, fixture design, and automation upgrades
  • Bachelor’s degree in Electrical, Electronics, Industrial, or Mechanical Engineering.
  • Minimum 5 years of THT process engineering experience in electronics manufacturing.
  • Advanced knowledge of IPC-A-610 and J-STD-001 standards.
  • Strong knowledge of solder alloys (SnAgCu, SnPb), flux systems, and thermal management
  • Experience in automotive, aerospace, or medical electronics preferred.
  • Good command in English.
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