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GPV is seeking an experienced THT Process Engineer to lead through-hole technology and soldering operations, including wave and selective soldering, while ensuring high-reliability joints and IPC standard conformance.
Responsibilities include optimizing soldering profiles, programming selective soldering, standardizing manual processes, and driving CAPA and continuous improvement. English proficiency required; automotive/aerospace/medical electronics experience is a plus.
THT & Soldering is responsible for leading Through-Hole Technology (THT) and soldering operations, including wave, selective, and manual soldering processes. Based on benchmarking of more than 30 comparable industry job descriptions, this role demands deep expertise in solder metallurgy, flux chemistry, thermal dynamics, and high-reliability solder joint formation.