PROCESS ENGINEER THT

GPV Mexico; Región Centro; Presencial; MXN 1.800.000 - 2.700.000; Jornada completa

Descripción de la vacante

GPV Mexico seeks a THT Process Engineer to lead through-hole technology and soldering operations, including wave and selective soldering, with focus on high-reliability joints.

The ideal candidate has a bachelor's in engineering, 5+ years in THT, and deep IPC-A-610/J-STD-001 knowledge, plus experience reducing defects and driving CAPA in electronics manufacturing.

You will develop work instructions, train operators, and support tooling and automation upgrades in a high-mix environment.

Formación

• Bachelor’s degree in Electrical, Electronics, Industrial, or Mechanical Engineering.
• Minimum 5 years of THT process engineering experience in electronics manufacturing.
• Advanced knowledge of IPC-A-610 and J-STD-001 standards.
• Strong knowledge of solder alloys (SnAgCu, SnPb), flux systems, and thermal management.
• Experience in automotive, aerospace, or medical electronics preferred.

Responsabilidades

• Lead optimization of wave soldering profiles including flux application, preheat configuration, dwell time, and conveyor speed.
• Own selective soldering programming and nozzle optimization.
• Standardize manual soldering operations and manage operator certification programs.
• Reduce defects including solder bridges, insufficient fill, icicles, solder skips, and blow holes.
• Perform root cause analysis using cross-sections, microanalysis, and solder joint inspection techniques.
• Develop and maintain work instructions and training materials aligned with IPC standards.
• Drive CAPA implementation and continuous improvement projects.
• Support tooling, fixture design, and automation upgrades

Conocimientos

THT process engineering

IPC-A-610

J-STD-001

Solder alloys

Flux systems

Thermal management

Root cause analysis

CAPA

Educación

Bachelors in Electrical/Electronics/Industrial/Mechanical Engineering

Herramientas

IPC standards

Descripción del empleo

THT & Soldering is responsible for leading Through-Hole Technology (THT) and soldering operations, including wave, selective, and manual soldering processes. Based on benchmarking of more than 30 comparable industry job descriptions, this role demands deep expertise in solder metallurgy, flux chemistry, thermal dynamics, and high-reliability solder joint formation.

Lead optimization of wave soldering profiles including flux application, preheat configuration, dwell time, and conveyor speed.

Own selective soldering programming and nozzle optimization.

Standardize manual soldering operations and manage operator certification programs.

Reduce defects including solder bridges, insufficient fill, icicles, solder skips, and blow holes.

Perform root cause analysis using cross-sections, microanalysis, and solder joint inspection techniques.

Develop and maintain work instructions and training materials aligned with IPC standards.

Drive CAPA implementation and continuous improvement projects.

Support tooling, fixture design, and automation upgrades

Job requirements

Bachelor’s degree in Electrical, Electronics, Industrial, or Mechanical Engineering.

Minimum 5 years of THT process engineering experience in electronics manufacturing.

Advanced knowledge of IPC-A-610 and J-STD-001 standards.

Strong knowledge of solder alloys (SnAgCu, SnPb), flux systems, and thermal management

Experience in automotive, aerospace, or medical electronics preferred.