Memory CAD Engineer for HBM/DRAM Innovation

micron; Xalisco; Presencial; MXN 900.000 - 1.300.000; Jornada completa

Descripción de la vacante

Micron Technology, a world leader in memory and storage, seeks an Engineer CAD at its Guadalajara Design Center. You will provide day-to-day CAD tool support for HBM design teams and collaborate with layout, verification, and design groups to deploy advanced capabilities.

You will work on mixed-signal, transistor-level IC design flows and enable efficient tape-out processes. The role requires 5+ years in CAD/design, familiarity with memory technologies (HBM, DDR, NAND), and experience with

Formación

• Bachelor’s or Master’s/PhD in Electrical/Computer Engineering, CS, or CE.
• 5+ years CAD or design experience in mixed-signal IC design flows.
• Experience in distributed, international IC design or CAD teams.
• Familiarity with memory design (DDR/HBM/NAND).

Responsabilidades

• Provide day-to-day CAD tools, flows, and collateral support for HBM design teams.
• Collaborate with HBM design, layout and verification to deploy advanced capabilities.
• Support mixed-signal, transistor-level design including layout, EDA flows, and simulations.

Conocimientos

CAD tools

IC design

mixed-signal design

agile sprints

ML in IC design

Educación

Bachelor's or Master/PhD in Electrical/Computer Engineering

Herramientas

Place & Route Tools

LPE

ERC

Descripción del empleo

Micron Technology, a world leader in memory and storage, seeks an Engineer CAD at its Guadalajara Design Center. You will provide day-to-day CAD tool support for HBM design teams and collaborate with layout, verification, and design groups to deploy advanced capabilities.

You will work on mixed-signal, transistor-level IC design flows and enable efficient tape-out processes. The role requires 5+ years in CAD/design, familiarity with memory technologies (HBM, DDR, NAND), and experience with