Senior Memory CAD Engineer HBM/DRAM Design

Micron Technology, Inc; Tlaquepaque; On-site; MXN 1,375,043 - 2,062,564; Full time

Job summary

Micron Technology, Inc in Tlaquepaque, Jalisco, is in search of a Sr Engineer in Memory CAD to support CAD tools and design processes for innovative memory designs impacting technologies like HBM and DRAM.

You will collaborate with design teams to enhance design methodologies and provide support in IC design, including mixed-signal and physical design verification.

The ideal candidate will hold an advanced degree in engineering and have significant experience in custom IC design flows.

Qualifications

• 5+ years of direct CAD or Design experience in mixed-signal, custom IC design flows.
• Proven ability to develop software prototypes for innovative ideas in IC design, layout, and analysis.
• Familiarity with memory design (DDR3/4/5, LP3/4/5, HBM, NAND).

Responsibilities

• Provide support for CAD tools and ensure they meet design team needs.
• Collaborate with design teams to propose and co-develop capabilities.
• Support aspects of IC design including layout, netlisting, and simulation.

Skills

CAD tools

Mixed-signal IC design

Custom layout

Analog circuit simulation

Machine Learning applications

Education

Bachelor's, Master's, or PhD in Computer Engineering, Computer Science, or Electrical Engineering

Tools

Automated place and route tools

Vendor tools

Job description

Micron Technology, Inc in Tlaquepaque, Jalisco, is in search of a Sr Engineer in Memory CAD to support CAD tools and design processes for innovative memory designs impacting technologies like HBM and DRAM.

You will collaborate with design teams to enhance design methodologies and provide support in IC design, including mixed-signal and physical design verification.

The ideal candidate will hold an advanced degree in engineering and have significant experience in custom IC design flows.