Senior Principal Broadband Optical IC Architect

Ams Osram; Milano; In loco; EUR 120.000 - 150.000; Tempo pieno

Descrizione del lavoro

ams OSRAM is seeking a Senior Principal Engineer - Broadband IC Architect to define broadband optical communication IC architectures and technology roadmaps in Milano, IT. You will lead architecture trade-off analyses and translate requirements into subsystem specs, guiding implementation teams and participating in customer discussions.

The ideal candidate holds MSc or PhD in Electrical Engineering, with 15+ years IC development experience and a track record of tape-outs in advanced CMOS nodes.

Competenze

• MSc or PhD in Electrical Engineering or related field.
• 15+ years semiconductor IC development experience.
• Multiple successful broadband optical communication IC tape-outs in advanced CMOS nodes.
• Broadband optical communication IC and PHY architectures with high-speed optical links and link-level trade-offs.
• Awareness of layout-dependent effects is an advantage.
• Expertise in TIA, VCSEL drivers, SerDes, PLL/CDR and ADC/DAC architectures.
• Advanced CMOS node experience, including FinFET and/or FD-SOI.
• MATLAB, Python and/or system modeling tools.

Mansioni

• Define broadband optical IC architectures and technology roadmaps.
• Lead architecture trade-off analyses and translate requirements into subsystem specifications.
• Guide implementation teams and support customer discussions on technology roadmaps.

Conoscenze

Broadband IC architecture

PHY design

SerDes

PLL/CDR

ADC/DAC

FinFET/FD-SOI

CMOS know-how

MATLAB

Python

Formazione

MSc or PhD in Electrical Engineering

Strumenti

MATLAB

Python

Descrizione del lavoro

ams OSRAM is seeking a Senior Principal Engineer - Broadband IC Architect to define broadband optical communication IC architectures and technology roadmaps in Milano, IT. You will lead architecture trade-off analyses and translate requirements into subsystem specs, guiding implementation teams and participating in customer discussions.

The ideal candidate holds MSc or PhD in Electrical Engineering, with 15+ years IC development experience and a track record of tape-outs in advanced CMOS nodes.