Senior Photonics Packaging Engineer for High-Speed Modules

Advanced Fiber Resources

Milano

In loco

EUR 70.000 - 95.000

Tempo pieno

14 giorni+
Generatore di candidature

Una candidatura mirata per questo annuncio — un curriculum e una lettera di presentazione pensati per rispondere alle esigenze dell'annuncio.

Supera i filtri ATS

Vantaggi offerti da questo lavoro

Meal vouchers
Health fund
Employee welfare platform

Descrizione del lavoro

Advanced Fiber Resources in San Donato Milanese is expanding its PIC development center and seeks an expert Packaging Engineer to join a growing team. You will design and develop optical/electro-optical packaging solutions for telecom, datacom and quantum photonics applications, collaborating across international teams.

We value 5+ years in relevant roles, CAD skills (SolidWorks/Creo), and strong communication.

Competenze

  • 5+ years in optical/electro-optical packaging roles.
  • Experience designing optical/electro-optical modules.
  • Proficiency with SolidWorks or Creo CAD.
  • Fluency in English (written and spoken).

Mansioni

  • Develop advanced electro-optical components and packaging solutions.
  • Address optical coupling, thermal management, and high-frequency interconnects.
  • Collaborate with NPI engineers to automate manufacturing processes and test workstations.
  • Contribute through all development phases from concept to manufacturing.
  • Define technical requirements, specifications, and procurement needs.
  • Act as the mechanical design authority across projects and product lines.
  • Define project plans and deliverables to meet schedules.
  • Provide regular status updates to management.
  • Perform tasks with independence and limited supervision.

Conoscenze

Optical packaging knowledge
Cross-functional teamwork
English proficiency

Strumenti

SolidWorks
Creo
Python scripting

Descrizione del lavoro

Advanced Fiber Resources in San Donato Milanese is expanding its PIC development center and seeks an expert Packaging Engineer to join a growing team. You will design and develop optical/electro-optical packaging solutions for telecom, datacom and quantum photonics applications, collaborating across international teams.

We value 5+ years in relevant roles, CAD skills (SolidWorks/Creo), and strong communication.

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