Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI; Turbigo; Ibrido; EUR 70.000 - 90.000; Tempo pieno

Vantaggi offerti da questo lavoro

Attractive compensation package

Pension plan

Employee insurances

Option for company shares

Descrizione del lavoro

Axelera AI in Turbigo is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape silicon and packaging architecture for AI accelerators. You will manage power delivery design from on-die grids to package analysis.

The ideal candidate has 7+ years of experience in the semiconductor sector, demonstrated knowledge in advanced packaging, and effective cross-functional collaboration skills. Join us and help innovate in a dynamic environment offering flexible working options.

Competenze

• 7+ years of experience in power delivery or advanced packaging design.
• Demonstrated expertise in power grid design and package/PCB analysis.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies.

Mansioni

• Own power-delivery design across the full stack.
• Lead advanced packaging architecture decisions.
• Collaborate with teams for product and silicon requirements.

Conoscenze

Power delivery design

Advanced packaging technologies

Cross-functional collaboration

EDA tools for power integrity

Communication skills

Formazione

Bachelor’s or Master’s degree in Electrical Engineering

Strumenti

EDA tools

Descrizione del lavoro

Axelera AI in Turbigo is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape silicon and packaging architecture for AI accelerators. You will manage power delivery design from on-die grids to package analysis.

The ideal candidate has 7+ years of experience in the semiconductor sector, demonstrated knowledge in advanced packaging, and effective cross-functional collaboration skills. Join us and help innovate in a dynamic environment offering flexible working options.