Photonics Packaging Engineer — Milan, Lab to Production

Intellectual Capital Resources Ltd; Lombardia; On-site; EUR 40,000 - 65,000; Full time

Job summary

Intellectual Capital Resources Ltd in Milan hires a Photonics Packaging Engineer to move PIC devices from lab prototypes toward production-ready modules. You’ll gain hands-on packaging experience within a growing photonics team at an onsite Milan site.

Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D teams.

Qualifications

• Degree in Photonics, Optical Engineering, Electronic Engineering or Materials Science.
• Hands-on photonics engineering or optoelectronics experience.
• Understanding of optical coupling, fibre alignment and attachment techniques.
• Familiarity with photonic assembly and packaging technologies.
• Basic knowledge of electrical interfaces or RF connectivity.
• Experience with laboratory testing and optical characterisation.

Responsibilities

• Support packaging and integration of photonic integrated circuits from prototype to testing.
• Assist with optical coupling, fibre alignment, attachment and bonding processes.
• Develop and improve assembly and packaging processes for manufacturability.
• Carry out optical characterisation and basic failure analysis of packaged devices.
• Analyse results and help improve package performance, reliability and yield.
• Collaborate with photonics, electronics and R&D teams to integrate packaging needs.

Skills

Photonics packaging

Optoelectronics

Fibre alignment

Optical testing

Packaging technologies

Education

Degree in Photonics

Degree in Optical Engineering

Degree in Electronic Engineering

Degree in Materials Science

Tools

Optical testing equipment

Job description

Intellectual Capital Resources Ltd in Milan hires a Photonics Packaging Engineer to move PIC devices from lab prototypes toward production-ready modules. You’ll gain hands-on packaging experience within a growing photonics team at an onsite Milan site.

Responsibilities include packaging, optical coupling, assembly process improvements, and basic failure analysis to enhance yield and reliability while collaborating with photonics, electronics, and R&D teams.