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Ephos is building advanced packaging on glass panels to enable die-to-die connectivity, scaling up to a new fabrication facility. We seek a Photonics Engineer who will own the femtosecond laser writing process and drive PIC capabilities from R&D to production, collaborating with manufacturing and product teams.
You will design, prototype, and iterate architectures, while working in a fast, ambitious startup environment that values excellence and hands-on learning.
Ephos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers.
We have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant, the first ever awarded to a startup.
As a Photonics Engineer at Ephos, you will drive the continuous advancement of our Photonic Integrated Circuit (PIC) capabilities. Taking complete ownership of our femtosecond laser writing process, you will design, prototype, and iterate next-generation architectures. This role sits at the critical juncture between research and manufacturing and you will play a hands-on role in scaling our technology from R&D to full-scale chip production while collaborating closely with our manufacturing and product teams.