TD EOL Process Engineer

Tata Electronics; Kolar; On-site; INR 800,000 - 1,200,000; Full time

Job summary

Tata Electronics, located in Kolar, India, is seeking a qualified professional for a role focused on developing cutting-edge packaging solutions for integrated circuits. The successful candidate will lead the team in new product development, ensuring optimal performance, reliability, and manufacturability.

Requirements include a degree in engineering, a minimum of 5 years in the OSAT industry, and expertise in problem-solving methodologies. This role requires strong leadership and technical skills to drive quality and yield improvements.

Qualifications

• Minimum 5+ years of experience in TD Development, Assembly Process Engineering.
• In-depth knowledge of semiconductor packaging materials and processes.
• Experience in multinational OSAT industry.

Responsibilities

• Develop cost-effective packaging solutions for integrated circuits.
• Lead a team to achieve goals in NTI/NPI programs.
• Drive yield and quality improvement processes.

Skills

Process stabilization

Yield improvement

Technical leadership

Problem-solving tools

Education

Degree in Engineering or equivalent

Tools

DOE

SPC

FMEA

MSA

Job description

Purpose Of The Job

• This role is responsible for developing cutting‑edge, cost‑effective packaging solutions for integrated circuits, ensuring optimal performance, reliability, and manufacturability.
• Fully accountable for new product development – design, material selection, qualification, LVM, offload, and process engineering.
• Able to lead technically the team of experts to achieve all deliverables through flawless execution on NTI/NPI programs and service the customer timely.

Key Responsibilities

• Hands‑on design of DOE, process characterization & optimization, develop manufacturable recipe meeting all CTQ matrices & yield.
• Strong understanding of semiconductor packaging materials, processes, and failure mechanisms.
• Familiar and hands‑on experience on TD/NPI methodology, covering all processes involved.
• Provide direction, technical leadership and hands‑on experience to ensure functional departments work in sync to achieve common goals.
• Lead, understand, integrate and innovate to meet customers’ packaging requirements into a cost‑competitive DFM solution.
• Create characterization plan and risk assessment for new and existing devices requiring engineering support.
• Use systematic problem‑solving methodology (ESDA/FMEA/SPC/DOE/MSA).
• Drive yield and quality improvement.
• Guide NPI & Process SMEs in resolving yield and quality issues.
• Define process flows and material sets, source & characterize materials, develop SOPs, ensure designs meet quality and industry standards.
• Source, characterize & qualify new material for packaging/technology.
• Customer interface – handle TD/engineer activities, quality performance meetings, manage issues.
• Work with TPM/customer for new NPI design win opportunities & technical issues.
• Drive material cost reduction programs via value engineering.
• Work cohesively with all supporting groups & operations team.

Essential Attributes

• Job is NTI & Assembly Process Engineering plant‑wide, affecting operations.
• In‑depth know‑how of DOE/SPC/FMEA/MSA/JMP and other problem‑solving tools.
• Proven record in process stabilization, yield improvement, and HVM support.

Qualifications

• Degree in Engineering or equivalent.

Desired Experience Level

• Minimum 5+ years of experience in TD Development, Assembly Process Engineering, in a multinational OSAT industry.
• Knowledgeable in package assembly process equipment & manufacturing.
• Knowledge of APQP standards and automotive standards.
• Experience leading a group/team towards organizational goals; advantage if both start‑up and HVM experience.