Staff Engineer Unit Process Engineering

Infineon Technologies AG; Malacca; On-site; INR 1,500,000 - 2,200,000; Full time

Job summary

Infineon Technologies AG seeks a Staff Engineer Unit Process Engineering to lead root-cause analysis and optimize transfer molding processes in high-volume production. You will champion 8D problem resolution, drive yield improvements, and mentor cross-functional teams for operational excellence.

The role emphasizes moldability concepts, reliability in molding, and proactive decision-making to prevent defects and improve productivity in semiconductor manufacturing.

Qualifications

• Bachelor's or Master degree in Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology.
• Strong moldability knowledge to predict and prevent defects.
• Experience in transfer molding and semiconductor manufacturing with MAP Mold and Cavity focus.

Responsibilities

• Lead root-cause analysis for molding defects and optimize transfer molding parameters.
• Drive yield, quality and cost improvement initiatives with robust tooling and process control.
• Support 8D closure, audit readiness, and cross-functional technical leadership.

Skills

Moldability concepts

Root-cause analysis

Process optimization

Transfer molding

8D problem solving

Leadership

Cross-functional guidance

Education

Bachelors/Masters in Mechanical/ Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology

Tools

MapMold

Cavity

FMEA

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Staff Engineer Unit Process Engineering, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?Your roleKey responsibilities in your new roleIn this role, you will lead root-cause analysis and process optimization for complex molding challenges, drive yield, quality, and cost improvement initiatives, and ensure robust tooling, process control, and manufacturing performance in high-volume production. You will also champion 8D problem resolution, maintain process documentation and audit readiness, and provide technical leadership and guidance to cross-functional teams to achieve operational excellence and project success.Lead root-cause analysis for complex molding defects and demonstrate a strong understanding of fluid dynamics to resolve localized wire sweep, S-curve deformations, mold void etc.Optimize transfer molding parameters, including transfer speed, injection pressure, and cure profiles to protect high-density wire profileReview, approve and ensure proper gate placement, runner balance, and venting before tooling fabricationSustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yieldAccountable and drive for 8D closure of FAR, MRB, DDM and SCARParticipate & handle in internal and external audit (internal/external) supportLead in yield & quality improvement projects & cost savings projectsResponsible in process documentation (e.g. : Process spec, OJTi, FMEA, failure catalogue, buildsheet and etc.)Provide technical consultation and guidance team to ensure team success in daily tasks and projectsSupport on auditing activitiesYour profileQualifications and skills to help you succeedYou strive in transfer molding and semiconductor manufacturing, leveraging strong expertise in moldability concepts, molding defect prevention, reliability requirements, and systematic problem-solving methodologies to drive process excellence. You excel in resolving complex production challenges, and ensuring high-quality manufacturing performance through proactive and effective decision-making.Bachelor's or Master degree in Mechanical/ Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor TechnologyMinimum 5 years related experience in Mold technology or Semiconductor manufacturing background, special focus on transfer molding (MapMold and Cavity)Highly proficient in moldability concept to predict and prevent overall molding defectsKnowledge of systematic problem-solving methodology (e.g. 8D, DMAIC, Process Mapping, FTA, Fish Bond…etc.)Good knowledge and skills in production areaGood leadership skills with the ability to communicate with different level of staffsFirst level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards)Ability to anticipate issues and challenges and resolving them quickly#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.