Sr. Packaging Engineer (Semiconductor)

Sierra Wireless; Hyderabad; Vor Ort; INR 1.200.000 - 2.000.000; Vollzeit

Zusammenfassung

Sierra Wireless is seeking a packaging engineer in India to drive new product packaging, design layouts for lead frames and substrate panels, and run risk analyses for launch readiness. You will collaborate with assembly subcons and global teams to ensure on-time product realization.

The role requires hands-on AutoCAD design experience, SolidWorks, thermal simulations, and strong analytical abilities to troubleshoot production issues and meet stringent schedules.

Qualifikationen

• B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering.
• 8 to 10 years of experience in packaging industry either for assembly subcon or as a designer in New Product Team
• Excellent analytical and trouble shooting skills with the ability to proactively solve issues
• Effective verbal and written communication to interface at all levels within the organization
• Strong sense of urgency to meet product requirements on schedule
• Experience in working with international and cross-functional teams
• AutoCAD package design is required. SolidWorks and Thermal simulations are plus.
• Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project

Aufgaben

• Develop new packages and processes to support new product launches on time.
• Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects.
• Troubleshoot and Support production related packaging issues.
• Designing new packages, layout of lead frame and substrate panels.
• Run risk analyses for new product scenarios.
• Debug subcon production issues.
• Make design and process decisions to achieve best in class new product realization.

Kenntnisse

Analytical skills

Troubleshooting

Communication

Cross-functional teams

Urgency to meet deadlines

Ausbildung

B.Sc. Eng. or equivalent

Masters in Materials Science or Electrical Engineering

Tools

AutoCAD

SolidWorks

Thermal simulations

Microsoft Office

Jobbeschreibung

Responsibilities:

• Develop new packages and processes to support new product launches on time. (50%)

• Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)

• Troubleshoot and Support production related packaging issues. (20%)

• Designing new packages, layout of lead frame and substrate panels.

• Run risk analyses for new product scenarios.

• Debug subcon production issues.

• Make design and process decisions to achieve best in class new product realization.

Minimum Qualifications:

• B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering

• 8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team

• Excellent analytical and trouble shooting skills with the ability to proactively solve issues

• Effective verbal and written communication to interface at all levels within the organization

• Strong sense of urgency to meet product requirements on schedule

• Experience in working with international and cross-functional teams

• AutoCAD package design is required. SolidWorks and Thermal simulations are plus.

• Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project