Senior Wafer Process Engineer

Skillventory; Jamnagar; On-site; INR 700,000 - 1,100,000; Full time

Job summary

Skillventory in Jamnagar, India, is seeking a data-driven Process Engineer for the Diamond Wire Slicing line to ensure silicon wafers meet thickness, flatness, and surface quality specifications.

You will analyze process performance, drive yield and cycle-time improvements, troubleshoot wafer defects, and collaborate with Production, Quality, Maintenance and R&D to implement new equipment, materials and SOPs.

Qualifications

• BE/B.Tech in Mechanical engineering or equivalent.
• Strong data analysis and statistical methods understanding.
• Experience in manufacturing processes and optimization.

Responsibilities

• Monitor and control diamond wire slicing to meet wafer specs.
• Analyze process performance and identify yield improvements; reduce wire consumption and cost.
• Support process optimization through experiments, data analysis, and CAPA implementation.
• Investigate and troubleshoot abnormalities (wafer breakage, wire marks, thickness variation).
• Collaborate with Production, Quality, Maintenance and R&D to resolve challenges and upgrade processes.
• Monitor key process parameters to ensure stability; document SOPs and control plans.
• Lead process validation, qualification, and trials for new equipment and materials.
• Participate in continuous improvement projects for wafer quality and cost reduction.
• Ensure safety, environmental, quality, and operational standards are met.
• Provide technical guidance and train operators.

Skills

Communication

Interpersonal skills

Microsoft Office

Minitab

Data analysis

Education

B.E./ B.Tech Mechanical

Tools

ISO 9001

ISO 14001

ISO 45001

ISO 50001

Job description

Role & responsibilities

Monitor and control Diamond Wire Slicing processesto ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.

• Analyze process performance dataand identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
• Support process optimization initiativesthrough experimentation, data analysis, and implementation of process improvements.
• Investigate and troubleshoot process abnormalitiessuch as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
• Collaborate with Production, Quality, Maintenance, and R&D teamsto resolve process challenges and implement new technologies or process upgrades.
• Monitor key process parametersincluding wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.
• Conduct root cause analysis (RCA)and implement corrective and preventive actions (CAPA) for process deviations and quality issues.
• Develop, update, and maintain process documentation, including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.

Support process validation, qualification, and trial activitiesfor new equipment, consumables, wire specifications, and process changes.

• Participate in continuous improvement projectsfocused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.
• Monitor and improve process capability (Cp/Cpk)through Statistical Process Control (SPC) and data-driven process management.
• Ensure compliance with safety, environmental, quality, and operational standardsin all slicing activities.
• Work closely with equipment engineers and maintenance teamsto improve equipment reliability, uptime, and preventive maintenance effectiveness.
• Support operator training and skill developmentby providing technical guidance and process-related coaching.
• Prepare technical reports and present process performance metricsincluding yield, productivity, quality trends, consumable consumption, and improvement project results.

Key Skills and Competencies:

• Excellent communication and interpersonal skills
• Microsoft Office, Minitab
• ISO 9001, 14001, 45001, 50001
• Six Sigma, QC Tools, Kaizen, Statistical Process Control, TQM (added advantage)

Qualifications:

• B.E./ B.Tech Mechanical

Required Technical Experience

• Design, implement and optimise industrial processes in the manufacturing setup. A good understanding of materials such as diamond wire and diamond tool and mechanics such as fluid movement and automation to manufacture silicon wafer for semi-conductor or solar applications preferred. Ability to do data analysis using engineering statistical methods preferred.