Group Leader – Die Prep & Dicing

3D Glass Solutions, Inc-; Khordha; On-site; INR 900,000 - 1,500,000; Full time

Job summary

3D Glass Solutions, Inc- seeks a Group Leader to oversee die preparation for flip chip BGA, fcCSP, and wbCSP families. You will own the module's processes and equipment, define process windows, qualify tools, and drive continuous improvements.

You will lead a cross-functional team of engineers and technicians, establish SOPs, training, and certification, and collaborate with wafer supply, design, metrology, and quality teams to sustain high yield and robust die prep performance.

Qualifications

• Engineering degree in a relevant field required.
• 10+ years in wafer backgrinding, mounting, laser grooving, and dicing in semiconductor ops.
• Experience training entry-level engineers and technicians.

Responsibilities

• Lead development and qualification of wafer backgrinding, lamination, mounting, sorting, laser grooving, dicing, and post-dice inspection.
• Build and develop the die preparation team with onboarding and training plans.
• Mentor engineers and technicians on die preparation, recipes, data-driven troubleshooting, and safety.

Skills

Leadership

Mentoring

Cross-functional teamwork

Process optimization

Data-driven troubleshooting

Education

Engineering degree (Mechanical, Materials, Electrical)

Tools

Grinder

Tape laminator

DAF mounter

Wafer sorter

Laser grooving system

Dicing saw

Job description

Job/Position Summary

The Group Leader - Die Prep & Dicing is responsible for leading development, optimization, qualification, and manufacturing support activities for wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice die inspection processes used in advanced semiconductor assembly. The role focuses on achieving robust die preparation performance with emphasis on die thickness control, total thickness variation, die strength, kerf quality, defect reduction, and high manufacturing yield.

This position plays a key leadership role in establishing a qualified and scalable die preparation module for flip chip BGA, fcCSP, and wbCSP product families. The role carries combined process and equipment ownership for the module, covering process window definition, tool qualification, equipment capability, and module yield, while managing cross-functional engineering activities, building and developing the module engineering and technician team, and driving continuous process improvements.

Primary Responsibilities

• Lead development, optimization, and qualification of wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice inspection processes for flip chip BGA, fcCSP, and wbCSP product families.
• Build and develop the die preparation team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices, and progression planning toward independent multi-tool ownership.
• Mentor and coach entry level process engineers and technicians on die preparation fundamentals, recipe structure, data-driven troubleshooting, and safe equipment handling, while driving technical excellence, process discipline, and continuous learning within the die preparation group.
• Define and control critical process parameters including target die thickness, total thickness variation, grinding wheel selection and grit sequence, spindle load, feed rate, chuck flatness, stress relief by dry polish or DCF, lamination temperature and roller pressure, laser power, pulse frequency and width, spot size, pass count, groove depth and width, blade selection, dressing and exposure, cut depth into tape, and coolant flow and DI water resistivity.
• Own and improve die preparation process performance with focus on thickness uniformity, die strength, kerf placement accuracy, chipping control, and process robustness.
• Lead root cause analysis and corrective actions for defects including front-side and backside chipping, die and wafer cracking, backside grinding damage, total thickness variation excursions, DAF voids, lamination bubbles, heat-affected zone damage, street residue, and missing or inverted die.
• Establish and maintain die strength control using three-point bend and die shear methods, and correlate grinding, grooving, and dicing conditions to measured die strength.
• Drive process qualification, DOE execution, process characterization, and recipe optimization for new tools, tapes, DAF materials, consumables, and product introductions.
• Qualify tape, DAF, wheel, and blade suppliers with emphasis on lamination quality, UV release behavior, pickability after dicing, consumable life, shelf and floor life, and lot-to-lot consistency.
• Collaborate closely with wafer supply, package design, die attach, metrology, and quality teams to ensure saw street and kerf definition, process compatibility, defect control, and stable manufacturing performance.
• Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, throughput enhancement, cycle time reduction, and process stability.
• Develop and maintain SOPs, process specifications, OCAPs, control plans, and process documentation for manufacturing operations.
• Develop training material, qualification checklists, and certification criteria for each tool and unit process in the module and certify engineers and technicians against those criteria before independent operation and shift coverage.
• Own equipment process qualification activities including SAT, IQ/OQ/PQ, process acceptance, and production release for grinders, tape laminators, tape and DAF mounters, wafer sorters, laser grooving systems, dicing saws, and post-dice inspection tools.
• Drive preventive maintenance optimization, spare parts strategy, calibration, and equipment health monitoring in collaboration with the maintenance organization to improve MTBF and reduce MTTR.
• Lead troubleshooting and recovery of die preparation equipment issues related to spindles, porous ceramic chucks, wheel and blade change mechanisms, wafer handling robots and end effectors, DI water and coolant delivery systems, laser optics, UV cure units, and vision and alignment systems to minimize production downtime.

Requirements

• Engineering degree in Mechanical Engineering, Materials Science, Electrical Engineering, Semiconductor Engineering, or related field required.
• More than 10 years of experience in wafer backgrinding, wafer mounting, laser grooving, and wafer dicing within semiconductor assembly, OSAT, or advanced packaging operations, with demonstrated ownership of multiple tool types, including participation in at least one new line installation, qualification, or capacity ramp.
• Demonstrated experience training and developing entry level engineers and technicians in a multi-tool production environment required.
• Willing to relocate to Bhubaneswar, Odisha, India.

Knowledge, Skills, and Abilities

• Strong understanding of thin wafer handling, backgrinding and stress relief mechanisms, laser grooving of low-k and copper pad structures, blade dicing mechanics, and die strength and chipping control.
• Experience with SPC, DOE, FMEA, process characterization, yield analysis, and advanced troubleshooting methodologies.
• Strong hands-on experience with grinder, laminator, mounter, wafer sorter, laser grooving, and dicing saw platforms, including recipe structure, alarm handling, and first-line maintenance.
• Experience with thickness metrology, optical and confocal inspection, SEM cross-section, die shear, and three-point bend testing is highly preferred.
• Proven capability to build, train, and develop entry level engineers and technicians, including onboarding, structured on-the-job training, skill certification, competency assessment, and progression planning.
• Prior leadership experience managing engineers, technicians, and cross-functional project teams in a production or ramp environment is required.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.