Group Leader – SMT

3D Glass Solutions, Inc-; Khordha; On-site; INR 2,600,000 - 4,500,000; Full time

Job summary

3D Glass Solutions, Inc- is seeking a Group Leader – SMT to lead development, optimization, qualification, and manufacturing support for solder paste printing, inspection, placement, and reflow processes on PCB strip formats used in advanced semiconductor assembly.

You will build and mentor the SMT team, drive DOE, process characterization, and tool qualification, while ensuring high yield and robust process performance across SiP/AiP modules and related families.

Qualifications

• Engineering degree in Mechanical, Electrical, Materials, or Industrial engineering or related field.
• 10+ years in SMT process engineering within semiconductor packaging or high-mix electronics manufacturing.
• Experience training entry level engineers and technicians in a multi-tool environment.
• Willing to relocate to Bhubaneswar, Odisha, India.

Responsibilities

• Lead development, optimization, and qualification of SMT processes for SiP and AiP modules and related product families.
• Build and develop the SMT team with onboarding and training plans.
• Mentor engineers and technicians in SMT fundamentals and data-driven troubleshooting.
• Define control parameters for stencil geometry, foil, squeegee, and reflow profiling.
• Drive process qualification, DOE, and tool qualification for new equipment and materials.
• Establish and maintain assembly cleanliness controls and support pilot lines.

Skills

Leadership

Team management

Mentoring

Root cause analysis

Troubleshooting

Education

Engineering degree in Mechanical Engineering, Electrical Engineering, Materials Science, Industrial Engineering or related field

Tools

Solder paste printer

SPI system

AOI system

Reflow oven

Placement platform

Cleaning system

Job description

Job/Position Summary

The Group Leader – SMT is responsible for leading development, optimization, qualification, and manufacturing support activities for solder paste printing, solder paste inspection, component placement, reflow soldering, post-reflow cleaning, and automated optical inspection processes on PCB strip format used in advanced semiconductor assembly. The role focuses on achieving robust surface mount performance with emphasis on print transfer efficiency, placement accuracy, solder joint integrity, voiding control, defect reduction, and high manufacturing yield.

This position plays a key leadership role in establishing a qualified and scalable SMT module for SiP and AiP modules, fcCSP, and wbCSP product families. The role carries combined process and equipment ownership for the module, covering process window definition, tool qualification, equipment capability, and module yield, while managing cross-functional engineering activities, building and developing the module engineering and technician team, and driving continuous process improvements.

Primary Responsibilities

• Lead development, optimization, and qualification of solder paste printing, solder paste inspection, component placement, reflow soldering, cleaning, and automated optical inspection processes for SiP and AiP modules, fcCSP, and wbCSP product families.
• Build and develop the SMT team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices, and progression planning toward independent multi-tool ownership.
• Mentor and coach entry level process engineers and technicians on SMT fundamentals, recipe structure, data-driven troubleshooting, and safe equipment handling, while driving technical excellence, process discipline, and continuous learning within the SMT group.
• Define and control critical process parameters including stencil aperture geometry and area ratio, foil thickness and material, squeegee pressure and speed, separation speed, print gap, understencil cleaning frequency, solder paste alloy and powder size, solder paste inspection limits for volume, height, area, and offset, nozzle and feeder selection, placement force and accuracy, and reflow ramp rate, soak, time above liquidus, peak temperature, cooling rate, and nitrogen concentration.
• Own and improve SMT process performance with focus on print transfer efficiency, placement accuracy, solder joint quality, voiding control, assembly cleanliness, and process robustness.
• Lead root cause analysis and corrective actions for defects including insufficient and excessive paste deposition, bridging, solder balling, tombstoning, component misplacement and absence, solder voiding, head-in-pillow, non-wetting, flux residue, and ionic contamination.
• Establish reflow profiling methodology for each product and substrate configuration using instrumented strips, and re-qualify profiles following oven, product, or material changes.
• Own board support and carrier tooling strategy for strip format, including support pin layout, dedicated carriers, and fiducial and panel registration schemes for warpage control.
• Drive process qualification, DOE execution, process characterization, and recipe optimization for new tools, solder pastes, fluxes, cleaning chemistries, component packages, and product introductions.
• Establish and maintain assembly cleanliness controls with verification by ROSE, ion chromatography, and surface insulation resistance methods as required by the product.
• Collaborate closely with package design, die attach, materials and supplier quality, quality, and MES teams to ensure land pattern and stencil design suitability, process compatibility, defect control, and stable manufacturing performance.
• Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, throughput enhancement, cycle time reduction, and process stability.
• Develop and maintain SOPs, process specifications, OCAPs, control plans, and process documentation for manufacturing operations.
• Develop training material, qualification checklists, and certification criteria for each tool and unit process in the module, and certify engineers and technicians against those criteria before independent operation and shift coverage.
• Own equipment process qualification activities including SAT, IQ/OQ/PQ, process acceptance, and production release for solder paste printers, solder paste inspection systems, component placement platforms, reflow ovens, cleaning systems, and automated optical inspection tools.
• Drive preventive maintenance optimization, spare parts strategy, calibration, and equipment health monitoring in collaboration with the maintenance organization to improve MTBF and reduce MTTR.
• Lead troubleshooting and recovery of SMT equipment issues related to print heads and squeegee assemblies, stencil handling, feeders, nozzles and placement heads, vision and fiducial recognition systems, conveyor and edge support mechanisms, oven blowers and thermal zones, and cleaning pumps, filtration, and DI water systems to minimize production downtime.

Requirements

• Engineering degree in Mechanical Engineering, Electrical Engineering, Materials Science, Industrial Engineering, or related field required.
• More than 10 years of experience in SMT process engineering within semiconductor packaging, module assembly, or high-mix electronics manufacturing, with demonstrated ownership of printing, placement, and reflow processes, including participation in at least one new line installation, qualification, or capacity ramp.
• Demonstrated experience training and developing entry level engineers and technicians in a multi-tool production environment required.
• Willing to relocate to Bhubaneswar, Odisha, India.

Knowledge, Skills, and Abilities

• Strong understanding of solder paste rheology and transfer efficiency, stencil design and area ratio principles, reflow metallurgy and profiling of mixed-mass assemblies, cleaning chemistry, and substrate warpage behavior.
• Experience with SPC, DOE, FMEA, process characterization, yield analysis, and advanced troubleshooting methodologies.
• Strong hands-on experience with solder paste printers, solder paste inspection and automated optical inspection systems, component placement platforms, and forced convection reflow ovens.
• Working knowledge of IPC-A-610 and J-STD-001 Class 2 and Class 3 acceptance criteria, and experience with strip or panel format assembly for SiP, AiP, or module products, is highly preferred.
• Proven capability to build, train, and develop entry level engineers and technicians, including onboarding, structured on-the-job training, skill certification, competency assessment, and progression planning.
• Prior leadership experience managing engineers, technicians, and cross-functional project teams in a production or ramp environment is required.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.