Group Leader Die Attach And Underfill

3D Glass Solutions, Inc.; Khordha; On-site; INR 3,000,000 - 4,900,000; Full time

Job summary

3D Glass Solutions, Inc. in Bhubaneswar, India, is seeking a Group Leader – Die Attach & Underfill to lead development, qualification, and manufacturing support for flip chip die attach and related processes.

The role emphasizes process robustness, high yield, and cross-functional collaborations with packaging, reliability, and quality teams. You will own tool qualification, DOE, and process optimization, build a multi-tool engineering and technician team, and drive continuous improvements

Qualifications

• Engineering degree in a related field.
• 10+ years in flip chip die attach and underfill.
• Experience training engineers in a multi-tool environment.
• Willing to relocate to Bhubaneswar, Odisha, India.

Responsibilities

• Lead development, optimization, and qualification of die attach and underfill processes.
• Build and develop the die attach and underfill team.
• Mentor entry level engineers and technicians in process fundamentals.
• Define control parameters for bond, placement, and underfill processes.
• Drive process qualification, DOE, and tool qualification for new assets.
• Collaborate with cross-functional teams to ensure process compatibility.
• Support pilot line and high-volume ramp with yield improvement.
• Develop SOPs, training materials, and certification criteria.

Skills

Leadership

Team development

DOE

Process characterization

Yield analysis

Troubleshooting

Cross-functional collaboration

Data-driven decision making

Communication

Education

Engineering degree

Tools

X-ray inspection

C-SAM analysis

Underfill dispensing systems

Plasma treatment systems

Die attach equipment

IQ/OQ/PQ procedures

Job description

Job Description:

Job/Position Summary

The Group Leader – Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and underfill performance with emphasis on placement accuracy, solder joint integrity, underfill flow and void control, adhesion, defect reduction, and high manufacturing yield.

This position plays a key leadership role in establishing a qualified and scalable die attach and underfill module for flip chip BGA, fcCSP, and wbCSP product families. The role carries combined process and equipment ownership for the module, covering process window definition, tool qualification, equipment capability, and module yield, while managing cross-functional engineering activities, building and developing the module engineering and technician team, and driving continuous process improvements.

Primary Responsibilities

• Lead development, optimization, and qualification of flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes for flip chip BGA, fcCSP, and wbCSP product families.
• Build and develop the die attach and underfill team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices, and progression planning toward independent multi-tool ownership.
• Mentor and coach entry level process engineers and technicians on die attach and underfill fundamentals, recipe structure, data-driven troubleshooting, and safe equipment handling, while driving technical excellence, process discipline, and continuous learning within the die attach and underfill group.
• Define and control critical process parameters including bond force, bond temperature and dwell time, placement accuracy in X, Y, and theta, flux transfer volume and application method, mass reflow profile and nitrogen concentration, joint standoff and collapse, plasma gas mixture, power, pressure and time, post-plasma queue time, underfill dispense weight and volume, needle standoff and dispense path, dispense and stage temperature, flow time, fillet geometry, and cure profile.
• Own and improve die attach and underfill process performance with focus on interconnect integrity, placement accuracy, bond line thickness control, underfill flow and void control, interfacial adhesion, and process robustness.
• Lead root cause analysis and corrective actions for defects including non-wet opens, bridging, cold joints, head-in-pillow, solder voids, die tilt and misplacement, underfill voiding and incomplete fill, resin bleed, filler settling, delamination, bump cracking, and die cracking.
• Establish substrate warpage management strategy through reflow, including profile adaptation, tooling selection, and coordination with package design on warpage and coplanarity limits.
• Drive process qualification, DOE execution, process characterization, and recipe optimization for new tools, fluxes, underfill materials, die attach adhesives and films, bump structures, and product introductions.
• Qualify flux, underfill, epoxy, and film materials with suppliers, addressing viscosity and thixotropic behavior, filler size relative to bump gap, pot life and floor life, Tg and CTE, adhesion performance, and lot-to-lot consistency.
• Collaborate closely with die preparation, SMT, wire bond and mold, package design, reliability, and quality teams to ensure process compatibility, defect control, and stable manufacturing performance.
• Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, throughput enhancement, cycle time reduction, and process stability.
• Develop and maintain SOPs, process specifications, OCAPs, control plans, and process documentation for manufacturing operations.
• Develop training material, qualification checklists, and certification criteria for each tool and unit process in the module, and certify engineers and technicians against those criteria before independent operation and shift coverage.
• Own equipment process qualification activities including SAT, IQ/OQ/PQ, process acceptance, and production release for flip chip bonders, die bonders, mass reflow ovens, flux cleaning systems, plasma treatment systems, underfill dispensers, and cure ovens.
• Drive preventive maintenance optimization, spare parts strategy, calibration, and equipment health monitoring in collaboration with the maintenance organization to improve MTBF and reduce MTTR.
• Lead troubleshooting and recovery of die attach and underfill equipment issues related to bond heads and heaters, pick tools and nozzles, vision and calibration systems, flux transfer units, dispense pumps, valves and needles, plasma RF generators and gas delivery systems, and oven thermal zones and nitrogen delivery to minimize production downtime.
• Lead the introduction of thermo-compression bonding and laser-assisted bonding capability as those platforms are added to the module, including specification development, qualification, and production release.

Requirements

• Engineering degree in Mechanical Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or related field required.
• More than 10 years of experience in flip chip die attach, die bonding, and underfill processes within semiconductor assembly, OSAT, or advanced packaging operations, with demonstrated ownership of multiple tool types, including participation in at least one new line installation, qualification, or capacity ramp.
• Demonstrated experience training and developing entry level engineers and technicians in a multi-tool production environment required.
• Willing to relocate to Bhubaneswar, Odisha, India.

Knowledge, Skills, and Abilities

• Strong understanding of solder joint metallurgy and intermetallic growth, copper pillar and C4 bump structures, substrate warpage behavior through reflow, underfill flow and capillary mechanics, and adhesion and delamination mechanisms.
• Experience with SPC, DOE, FMEA, process characterization, yield analysis, and advanced troubleshooting methodologies.
• Strong hands-on experience with flip chip and die bond platforms, plasma treatment systems, and underfill dispensing platforms.
• Experience with X-ray, C-SAM, cross-section analysis, die shear, and cold bump pull testing, and with fine-pitch, low-standoff flip chip underfill, is highly preferred.
• Proven capability to build, train, and develop entry level engineers and technicians, including onboarding, structured on-the-job training, skill certification, competency assessment, and progression planning.
• Prior leadership experience managing engineers, technicians, and cross-functional project teams in a production or ramp environment is required.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.