DFT Engineer

Cyient

Hyderabad

Presencial

INR 1 200 000 - 2 400 000

Tempo integral

14 dias+
Gerador de candidaturas

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Resumo da oferta

Cyient seeks a skilled DFT Engineer to support Qualcomm SoC development programs. The candidate will drive DFT architecture, scan insertion, ATPG generation, MBIST/LBIST integration, pattern validation, and silicon bring-up for complex mobile, automotive, and high‑performance SoCs.

You will collaborate with design, physical design, and verification teams to secure DFT signoff, support first silicon bring-up, and debug manufacturing test issues with ATE teams to improve yield.

Qualificações

  • Strong knowledge of Scan Architecture, Scan Compression, ATPG, MBIST/LBIST, JTAG/Boundary Scan, and related fault modeling.
  • Experience with DFT signoff methodologies.
  • Experience in RTL and gate-level DFT verification.

Responsabilidades

  • Perform RTL and gate-level DFT verification.
  • Validate scan functionality and test modes through simulation.
  • Work with design, physical design, and verification teams for DFT signoff.
  • Support first silicon bring-up and failure analysis.
  • Collaborate with ATE teams for production test development.
  • Debug manufacturing test issues and improve yield.

Conhecimentos

DFT Architecture
Scan Insertion
ATPG
MBIST/LBIST
JTAG/Boundary Scan
Fault Modeling
DFT Signoff Methodologies
Unix/Linux Shell Scripting

Formação académica

Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, Computer Engineering, or related field

Ferramentas

Cadence Modus

Descrição da oferta de emprego

We are seeking a highly skilled DFT Engineer to support Qualcomm SoC development programs. The candidate will be responsible for DFT architecture implementation, scan insertion, ATPG generation, MBIST/LBIST integration, pattern validation, and silicon bring-up activities for complex mobile, automotive, and high-performance SoC designs.

Key Responsibilities
DFT Implementation
  • Develop and implement DFT architectures for advanced SoC designs.
  • Perform scan insertion and scan chain validation using industry-standard EDA tools.
  • Integrate and verify DFT features including:
    • Scan Compression
    • EDT
    • MBIST
    • LBIST
    • Boundary Scan (JTAG/IEEE 1149.1)
    • OCC (On-Chip Clock Controller)
ATPG & Pattern Generation
  • Generate ATPG patterns for stuck-at, transition, path-delay, and bridge fault coverage.
  • Analyze fault coverage and optimize pattern count.
  • Debug DRC violations and pattern simulation failures.
Verification & Validation
  • Perform RTL and gate-level DFT verification.
  • Validate scan functionality and test modes through simulation.
  • Work closely with design, physical design, and verification teams for DFT signoff.
  • Support first silicon bring-up and failure analysis.
  • Collaborate with ATE teams for production test development.
  • Debug manufacturing test issues and improve yield.
Cross-Functional Collaboration
  • Interface with Architecture, RTL Design, Physical Design, STA, and Product Engineering teams.
Required Skills
Technical Skills
  • Strong understanding of:
    • Scan Architecture
    • Scan Compression
    • ATPG
    • MBIST/LBIST
    • JTAG/Boundary Scan
    • Fault Modeling
    • DFT Signoff Methodologies
EDA Tools
  • Experience with one or more:
    • Cadence Modus
Languages & Scripting
  • Unix/Linux Shell Scripting
Debug Skills
  • Scan chain debugging
  • ATPG pattern analysis
  • Silicon failure diagnosis
Preferred Qualifications
  • Experience on Qualcomm Snapdragon, Automotive, AI/ML, DSP, or Modem SoCs.
  • Exposure to low-power DFT methodologies.
  • Knowledge of UPF/CPF and power-aware testing.
  • Understanding of advanced-node designs (7nm, 5nm, 4nm, 3nm).
  • Prior silicon bring-up and yield improvement experience.
Education
  • Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, Computer Engineering, or a related field.
Keywords

DFT, Scan Insertion, ATPG, MBIST, LBIST, JTAG, Boundary Scan, Tessent, Modus, DFT Compiler, TestMAX, Silicon Bring-up, OCC, Compression, Fault Coverage, SoC, Qualcomm, Snapdragon.

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