We are seeking a highly skilled DFT Engineer to support Qualcomm SoC development programs. The candidate will be responsible for DFT architecture implementation, scan insertion, ATPG generation, MBIST/LBIST integration, pattern validation, and silicon bring-up activities for complex mobile, automotive, and high-performance SoC designs.
Key Responsibilities
DFT Implementation
- Develop and implement DFT architectures for advanced SoC designs.
- Perform scan insertion and scan chain validation using industry-standard EDA tools.
- Integrate and verify DFT features including:
- Scan Compression
- EDT
- MBIST
- LBIST
- Boundary Scan (JTAG/IEEE 1149.1)
- OCC (On-Chip Clock Controller)
ATPG & Pattern Generation
- Generate ATPG patterns for stuck-at, transition, path-delay, and bridge fault coverage.
- Analyze fault coverage and optimize pattern count.
- Debug DRC violations and pattern simulation failures.
Verification & Validation
- Perform RTL and gate-level DFT verification.
- Validate scan functionality and test modes through simulation.
- Work closely with design, physical design, and verification teams for DFT signoff.
- Support first silicon bring-up and failure analysis.
- Collaborate with ATE teams for production test development.
- Debug manufacturing test issues and improve yield.
Cross-Functional Collaboration
- Interface with Architecture, RTL Design, Physical Design, STA, and Product Engineering teams.
Required Skills
Technical Skills
- Strong understanding of:
- Scan Architecture
- Scan Compression
- ATPG
- MBIST/LBIST
- JTAG/Boundary Scan
- Fault Modeling
- DFT Signoff Methodologies
EDA Tools
- Experience with one or more:
Languages & Scripting
- Unix/Linux Shell Scripting
Debug Skills
- Scan chain debugging
- ATPG pattern analysis
- Silicon failure diagnosis
Preferred Qualifications
- Experience on Qualcomm Snapdragon, Automotive, AI/ML, DSP, or Modem SoCs.
- Exposure to low-power DFT methodologies.
- Knowledge of UPF/CPF and power-aware testing.
- Understanding of advanced-node designs (7nm, 5nm, 4nm, 3nm).
- Prior silicon bring-up and yield improvement experience.
Education
- Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, Computer Engineering, or a related field.
Keywords
DFT, Scan Insertion, ATPG, MBIST, LBIST, JTAG, Boundary Scan, Tessent, Modus, DFT Compiler, TestMAX, Silicon Bring-up, OCC, Compression, Fault Coverage, SoC, Qualcomm, Snapdragon.