PhD: Wideband Baluns & Advanced IC Packaging

Tyndall National Institute; Cork; In loco; EUR 23.000 - 28.000; Tempo pieno

Vantaggi offerti da questo lavoro

PhD funding

Tax-free stipend €25,000/year

Access to fabrication facilities

Industry-academia collaboration

Descrizione del lavoro

Tyndall National Institute, in collaboration with AMD, offers a fully funded PhD opportunity at University College Cork focused on wideband balun technologies and their integration into advanced IC packaging.

The project will involve electromagnetic modelling, RF/mm‑wave measurements, fabrication of prototypes and close industry collaboration to translate research outcomes into practical semiconductor applications.

Competenze

• First-Class Honours in Electrical/Electronic Engineering or closely related discipline.
• Strong foundation in electromagnetics, RF/microwave engineering and related subjects.
• Experience with RF/electromagnetic CAD tools and RF/mm-wave measurement is advantageous.

Mansioni

• Conduct literature reviews on wideband balun technologies and RF packaging.
• Model, design, fabricate prototypes and validate balun performance for IC packaging.
• Perform RF/mm-wave measurements and electromagnetic simulations.
• Collaborate with AMD and academic partners to translate research into practical applications.
• Prepare technical reports, publications, and project updates.

Conoscenze

Electromagnetics

RF/Microwave engineering

Mathematical modelling

MATLAB

English proficiency

Formazione

First-Class Honours degree in Electrical/Electronic Engineering

MSc/MEng or equivalent (desirable)

Strumenti

Keysight ADS

CST Microwave Studio

HFSS

MATLAB

Descrizione del lavoro

Tyndall National Institute, in collaboration with AMD, offers a fully funded PhD opportunity at University College Cork focused on wideband balun technologies and their integration into advanced IC packaging.

The project will involve electromagnetic modelling, RF/mm‑wave measurements, fabrication of prototypes and close industry collaboration to translate research outcomes into practical semiconductor applications.