Fully Funded PhD: Wideband Baluns & IC Packaging

Tyndall National Institute; Cork; On-site; EUR 23,000 - 28,000; Full time

Benefits offered by this job

PhD funding

Tuition paid

Stipend (€25k/year)

Job summary

Tyndall National Institute, University College Cork, in collaboration with AMD, is offering a fully funded PhD opportunity designed to foster close collaboration and knowledge exchange between academia and industry. The programme focuses on advanced RF technologies for next‑generation IC packaging.

The PhD study will investigate wideband balun architectures, RF/mm‑wave modelling, fabrication and packaging integration, with hands‑on measurements and publication of results.

Qualifications

• First-Class Honours degree in Electrical/Electronic Engineering or Physics required.
• Strong foundation in electromagnetics, RF/microwave engineering or related subjects.
• Proficiency in MATLAB and RF CAD tools, and willingness to learn new measurement techniques.
• Experience with RF/mm-wave measurement and characterisation is advantageous.

Responsibilities

• Conduct modelling, design, fabrication and optimisation of wideband baluns for high‑frequency IC packaging.
• Perform RF/mm‑wave measurements and characterisation using VNAs, spectrum analysers and probe stations.
• Collaborate with AMD and academic partners to translate research into industrial applications.
• Publish findings in peer‑reviewed journals and present at conferences.
• Prepare technical documentation and progress reports and contribute to project meetings.

Skills

MATLAB

RF/Microwave engineering

Independent researcher

English proficiency

Education

First-Class Honours degree in Electrical/Electronic Engineering or Physics

Tools

Keysight ADS

Vector network analysers

Probe stations

Job description

Tyndall National Institute, University College Cork, in collaboration with AMD, is offering a fully funded PhD opportunity designed to foster close collaboration and knowledge exchange between academia and industry. The programme focuses on advanced RF technologies for next‑generation IC packaging.

The PhD study will investigate wideband balun architectures, RF/mm‑wave modelling, fabrication and packaging integration, with hands‑on measurements and publication of results.