Postdoc: Integrated Magnetics for Next‑Gen Chip Packaging

Tyndall

Cork

Hybrid

EUR 47,000 - 60,000

Full time

3 days ago
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Benefits offered by this job

Pension scheme
Annual leave
Blended working

Job summary

Tyndall National Institute seeks a Postdoctoral or Senior Postdoctoral Researcher to develop magnetic materials and integrated magnetic components for efficient power conversion in advanced semiconductor systems. You will work in IPES, collaborating with fabrication, characterization and circuit-design teams at Cork.

The role combines experimental materials research with device design and modelling, offering access to deposition, cleanroom and measurement facilities, with opportunities to

Qualifications

  • PhD degree in Physics, Materials Science, Electrical or Electronic Engineering, or related field.
  • Strong knowledge of soft magnetic materials and device physics.
  • Experience with magnetic thin-film deposition or related processing and characterization.

Responsibilities

  • Plan and undertake research on soft magnetic materials and integrated magnetic components linking properties to device performance.
  • Develop and optimize magnetic thin-film deposition and processing.
  • Characterise magnetic materials and devices and interpret effects of processing on magnetic response and loss.
  • Design and model integrated magnetic devices using physical, analytical and numerical approaches.

Skills

Python
MATLAB
Research planning
English communication

Education

PhD degree

Tools

Python
MATLAB

Job description

Tyndall National Institute seeks a Postdoctoral or Senior Postdoctoral Researcher to develop magnetic materials and integrated magnetic components for efficient power conversion in advanced semiconductor systems. You will work in IPES, collaborating with fabrication, characterization and circuit-design teams at Cork.

The role combines experimental materials research with device design and modelling, offering access to deposition, cleanroom and measurement facilities, with opportunities to

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