PhD in Photonic Packaging & Assembly for Integrated Systems

Tyndall National Institute; Cork; On-site; EUR 23,000 - 28,000; Full time

Benefits offered by this job

Tax-free stipend and tuition fees paid

Travel to international conferences

Training and development opportunities

University facilities access

Job summary

Tyndall National Institute, in partnership with Rinn Semiconductor, offers a fully funded PhD position focused on advanced design, assembly and packaging technologies for photonic systems. The PACK theme enables scalable packaging solutions and integration across photonic and electronic platforms.

The four-year studentship provides a €25,000 annual stipend plus tuition coverage, with opportunities for international conference travel and professional development.

Qualifications

• A first-class honours degree in a closely related engineering field.
• Strong background in mechanical design, product development or photonics-related engineering.
• Experience with CAD and engineering design tools (e.g. SolidWorks) is preferred.

Responsibilities

• Investigate novel package architectures for advanced photonic systems.
• Develop new assembly technologies for fibre-to-PIC integration.
• Design and optimise photonic packaging using CAD, simulation and DFM principles.
• Explore additive manufacturing and 3D printing for scalable packaging.
• Fabricate and validate novel packaging concepts using university facilities.
• Develop packaging methodologies supporting future Rinn semiconductor demonstrators.
• Support education and public engagement activities as required.
• Ensure compliance with Quality Management Systems and safety standards.
• Carry out additional duties within scope of the post.

Skills

Analytical skills

Problem-solving

Communication skills

Education

First-class honours degree in Mechanical/Electrical/Manufacturing Eng, Mechatronics, Photonics, Physics

Tools

CAD (SolidWorks)

Job description

Tyndall National Institute, in partnership with Rinn Semiconductor, offers a fully funded PhD position focused on advanced design, assembly and packaging technologies for photonic systems. The PACK theme enables scalable packaging solutions and integration across photonic and electronic platforms.

The four-year studentship provides a €25,000 annual stipend plus tuition coverage, with opportunities for international conference travel and professional development.