PhD / Masters – Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems

Tyndall National Institute; Cork; On-site; EUR 25,000 - 30,000; Full time

Benefits offered by this job

Stipend €25,000/year

Tuition fees paid

Travel expenses to conferences

Mardyke Sports Arena access

Free Park and Ride

Job summary

Tyndall National Institute, hosted at UCC in Cork, Ireland, offers a fully funded PhD position in Advanced Design, Assembly and Packaging for photonic systems. The project sits within Rinn Semiconductor’s PACK theme and targets scalable packaging for photonic/electronic systems.

The role focuses on automated fibre-to-PIC integration, design-for-manufacture, and innovative packaging concepts, with a stipend and tuition covered. Applicants should meet the stated criteria and English requirements.

Qualifications

• First-class honours degree in Mechanical Engineering, Photonics or related field.

Responsibilities

• Investigate novel package architectures and design methodologies for advanced photonic systems.
• Develop new assembly technologies for fibre-to-PIC integration, including automated assembly and alignment.
• Design and optimise photonic packaging solutions using CAD, simulation and design-for-manufacture principles.
• Explore advanced manufacturing approaches, including additive manufacturing and 3D printing.
• Fabricate and validate novel packaging concepts and demonstrators using state-of-the-art facilities.
• Develop design rules and packaging methodologies to support demonstrators across applications.
• Participate in Education and Public Engagement activities as required.
• Ensure compliance with Quality, Health & Safety standards and other regulations.
• Carry out additional duties within the scope of the post.

Skills

Analytical skills

Problem-solving

Communication skills

CAD

Education

First-class honours in Mechanical Engineering

First-class honours in Photonics

Tools

SolidWorks

Job description

PhD/ Masters – Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems

(Rinn Semiconductor — Ireland’s Centre for Semiconductor Innovation PACK Theme: Advanced Packaging for Integrated Photonic Systems)

About Tyndall

Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).

Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.

The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.

With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.

Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.

About Rinn Semiconductor

Rinn Semiconductors is part of a constellation of seven major new centres which collectively represent an investment of €460M in advanced research by the Government of Ireland. Rinn Semiconductors aims to lead Ireland’s response to the end of Moore’s Law scaling, the point where traditional improvements in computer chips slows down or ends, by pioneering modular integrated circuit-based (chiplet-based) semiconductor design and integration. With deep expertise in the areas of Heterogeneous Integration and Advanced Packaging, the Rinn Semiconductors team propose to enable transformative advances in these technologies and to apply them in three main application areas: Future Internet, Sustainable Energy and Environment, and Digital Healthcare. A key objective of the Rinn is to foster deep collaboration across the seven universities and institutions involved, by leveraging the semiconductor fabrication facilities at Tyndall, ultimately creating a cohesive “atom to systems” value chain in Ireland, connecting everything from basic materials research through to complete technology solutions. The Rinn will operate in close collaboration with Ireland’s vibrant semiconductor industry sector which supports 20,000 high skilled jobs and includes world leading multinational companies, small and medium sized enterprises and start-ups.

About the Role

The PACK (Advanced Packaging) theme at Rinn Semiconductor, Ireland’s Centre for Semiconductor Innovation, hosted at Tyndall National Institute (a research flagship of University College Cork, UCC), is offering a fully funded PhD position focused on advanced design, assembly and packaging technologies for photonic systems. This research sits within the PACK theme, which aims to develop next-generation packaging platforms and integration technologies that enable scalable photonic and electronic systems across multiple application domains.

Today’s photonic systems are increasingly limited not by the performance of individual devices, but by the complexity of integrating lasers, photonic integrated circuits (PICs), fibres and electronic components into compact, manufacturable packages. Existing packaging approaches often rely on labour-intensive assembly, precision optical alignment and bespoke manufacturing processes that are difficult to scale. By combining innovations in advanced packaging, glass interposers, optical interconnects and heterogeneous integration, the PACK theme will develop the technologies needed to realise compact, high-performance and manufacturable photonic systems for future communications, healthcare and environmental sensing applications.

This PhD will develop advanced design and assembly methodologies for photonic packaging, with a particular focus on automated fibre-to-PIC integration, design for manufacture and assembly, and novel packaging technologies that improve alignment, scalability and manufacturability. The research will combine mechanical design, automation, advanced packaging concepts and experimental validation to develop enabling technologies that support future Rinn Semiconductor demonstrators and next-generation photonic systems.

Key Duties & Responsibilities

• Investigate novel package architectures and design methodologies for advanced photonic systems.
• Develop new assembly technologies for fibre-to-PIC integration, including automated assembly, alignment, soldering and advanced interconnect techniques.
• Design and optimise photonic packaging solutions using CAD, simulation and design-for-manufacture principles.
• Explore advanced manufacturing approaches, including additive manufacturing and 3D printing, to enable scalable photonic packaging.
• Fabricate and experimentally validate novel packaging concepts and demonstrators using state-of-the-art facilities at Tyndall National Institute.
• Develop design rules and packaging methodologies that support future Rinn Semiconductor demonstrators across communications, healthcare and environmental sensing.
• Participate in Education and support Public Engagement activities, as required.
• Ensure compliance with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations.
• To carry out any additional duties that may reasonably be required within the general scope and level of the post.

Essential Criteria

• A first-class honours degree (or equivalent) in Mechanical Engineering, Electronic/Electrical Engineering, Manufacturing Engineering, Mechatronics, Photonics, Physics, or a closely related discipline.
• Strong academic background in mechanical design, product development, advanced manufacturing, photonics, or a related engineering discipline.
• Experience with CAD and engineering design tools (e.g. SolidWorks or equivalent), together with an interest in advanced packaging and photonic systems.
• Excellent analytical, problem-solving and communication skills, with the ability to work independently and as part of a multidisciplinary research team.
• Must meet UCC’s postgraduate English language requirements through a recognised test qualification or an approved institution exemption.

Desirable Criteria

• Experience in automation, robotics, prototype development, or advanced manufacturing.
• Experience with additive manufacturing, 3D printing, or precision assembly techniques.
• Experience with laboratory testing, system integration, or product development.
• Interest in photonics, semiconductor packaging, or optical systems.

What We Offer

• A generous tax-free scholarship stipend payment including tuition fees covered.
• 20 days per annum annual leave for full-time research students, in addition to public holidays.
• Full coverage of travel expenses to international conferences to present project outcomes.
• Training and development opportunities are also provided.
• Mardyke Sports Arena -Students – free when registered with UCC
• Free Park and Ride Service
• Also see here for more information

Terms of Studentship

Contract: Full Time/Fixed Term
Duration : 4 years

The annual stipend is €25,000.00. In addition, annual tuition fees will be paid by the Tyndall National Institute.

Informal enquiries can be made in confidence to Padraic Morrissey
The closing date for applications for this position is 1pm, 31st August 2026.

Postgraduate applicants whose first language is not English must provide evidence of English language proficiency as per UCC regulations (https://www.ucc.ie/en/study/comparison/english/postgraduate/). Certificates should be valid (usually less than 2 years old) and should be uploaded with their application.

Please note that Garda vetting and/or an international police clearance check may form part of the selection process. The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process. Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector.

Tyndall National Institute does not require the assistance of recruitment agencies. Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.