PhD in Passive PICs for Co-Packaged AI Datacenters

Tyndall National Institute; West Cork; On-site; EUR 24,000 - 28,000; Full time

Benefits offered by this job

Full PhD funding including tuition and

Tax-free stipend

Travel to international conferences

Training and development opportunities

Free Park and Ride Service

Job summary

Tyndall National Institute within the NET 1 programme invites applications for a fully funded PhD position focused on passive photonic integrated circuits for multi-wavelength optical I/O in co-packaged and disaggregated systems. The project blends PIC design, tape-outs, optical modelling and automated characterisation.

Applicants will gain hands-on experience in photonic system integration, glass-to-chip interfaces and scalable control architectures, with a pathway to a career in advanced

Qualifications

• First-class or upper second-class honours degree in a relevant field.
• Strong interest in optical communications and integrated photonics.
• Strong analytical and programming skills in Python/MATLAB.
• Ability to work independently within a multidisciplinary team.
• Excellent written and verbal English for technical documentation.

Responsibilities

• Develop system-level models linking passive PIC performance to optical parameters.
• Design foundry-compatible passive PIC architectures for short-reach optical I/O.
• Optimize wavelength-routing, fiber coupling, monitoring and test structures.
• Investigate scalable control, calibration and monitoring architectures for large photonic element populations.
• Disseminate research through publications and conferences.

Skills

Python

MATLAB

Analytical skills

English communication

Education

Bachelor's degree in Electrical or Electronic Engineering, Physics, Photonics or closely related discipline

Master's degree in Physics or Engineering (desirable)

Tools

VPIphotonics

Lumerical

COMSOL

Job description

Tyndall National Institute within the NET 1 programme invites applications for a fully funded PhD position focused on passive photonic integrated circuits for multi-wavelength optical I/O in co-packaged and disaggregated systems. The project blends PIC design, tape-outs, optical modelling and automated characterisation.

Applicants will gain hands-on experience in photonic system integration, glass-to-chip interfaces and scalable control architectures, with a pathway to a career in advanced