PhD: Advanced Photonic Packaging & Assembly Design

Tyndall National Institute; Coolmore Cross; On-site; EUR 23,000 - 28,000; Full time

Benefits offered by this job

Tax-free scholarship

Tuition fees covered

4-year duration

Job summary

Tyndall National Institute at University College Cork is offering a fully funded PhD position focused on advanced design, assembly and packaging technologies for photonic systems within the PACK theme of Rinn Semiconductor.

The PhD will develop automated fibre-to-PIC integration, design for manufacture and novel packaging approaches to enable scalable, manufacturable photonic systems for future communications and healthcare applications.

Qualifications

• First-class honours degree in Mechanical, Electronic, Manufacturing, Mechatronics, Photonics or related field.
• Strong background in mechanical design, product development or photonics.
• Experience with CAD/engineering design tools (SolidWorks) and packaging.
• Excellent analytical, problem-solving and communication skills.
• Meets UCC English language requirements.

Responsibilities

• Investigate novel package architectures for advanced photonic systems.
• Develop new fibre-to-PIC assembly technologies including automated methods.
• Design and optimise photonic packaging using CAD and DFMA.
• Explore manufacturing approaches, including 3D printing, for scalable packaging.
• Fabricate and validate packaging concepts using institute facilities.
• Support packaging strategies for future Rinn Semiconductor demonstrators across applications.
• Participate in Education and Public Engagement activities and ensure Quality & Safety compliance.
• Carry out any additional duties as required.

Skills

CAD

Mechanical design

Photonic packaging

Problem-solving

Communication

Education

First-class honours degree in Mechanical Engineering

Tools

SolidWorks

Job description

Tyndall National Institute at University College Cork is offering a fully funded PhD position focused on advanced design, assembly and packaging technologies for photonic systems within the PACK theme of Rinn Semiconductor.

The PhD will develop automated fibre-to-PIC integration, design for manufacture and novel packaging approaches to enable scalable, manufacturable photonic systems for future communications and healthcare applications.