Fully Funded PhD in Photonics Packaging & Integration

Tyndall National Institute; Cork; Hybrid; EUR 25,000 - 30,000; Full time

Benefits offered by this job

Stipend €25,000/year

Tuition fees paid

Travel expenses to conferences

Mardyke Sports Arena access

Free Park and Ride

Job summary

Tyndall National Institute, hosted at UCC in Cork, Ireland, offers a fully funded PhD position in Advanced Design, Assembly and Packaging for photonic systems. The project sits within Rinn Semiconductor’s PACK theme and targets scalable packaging for photonic/electronic systems.

The role focuses on automated fibre-to-PIC integration, design-for-manufacture, and innovative packaging concepts, with a stipend and tuition covered. Applicants should meet the stated criteria and English requirements.

Qualifications

• First-class honours degree in Mechanical Engineering, Photonics or related field.

Responsibilities

• Investigate novel package architectures and design methodologies for advanced photonic systems.
• Develop new assembly technologies for fibre-to-PIC integration, including automated assembly and alignment.
• Design and optimise photonic packaging solutions using CAD, simulation and design-for-manufacture principles.
• Explore advanced manufacturing approaches, including additive manufacturing and 3D printing.
• Fabricate and validate novel packaging concepts and demonstrators using state-of-the-art facilities.
• Develop design rules and packaging methodologies to support demonstrators across applications.
• Participate in Education and Public Engagement activities as required.
• Ensure compliance with Quality, Health & Safety standards and other regulations.
• Carry out additional duties within the scope of the post.

Skills

Analytical skills

Problem-solving

Communication skills

CAD

Education

First-class honours in Mechanical Engineering

First-class honours in Photonics

Tools

SolidWorks

Job description

Tyndall National Institute, hosted at UCC in Cork, Ireland, offers a fully funded PhD position in Advanced Design, Assembly and Packaging for photonic systems. The project sits within Rinn Semiconductor’s PACK theme and targets scalable packaging for photonic/electronic systems.

The role focuses on automated fibre-to-PIC integration, design-for-manufacture, and innovative packaging concepts, with a stipend and tuition covered. Applicants should meet the stated criteria and English requirements.