Postdoc: Electronic Design & Advanced Packaging (Remote)

Tyndall National Institute

Cork

Hybrid

EUR 47,000 - 54,000

Full time

9 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Tyndall National Institute in Cork invites applications for a Post-Doctoral Researcher in Electronic Design and Advanced Packaging. You will join the Photonics Packaging and Systems Integration Group and contribute to EU and industry-funded projects delivering next-generation packaging solutions.

You will design, model, simulate and experimentally validate electronic devices and systems, collaborating across teams to translate concepts into demonstrators and scalable results, with opportunities

Qualifications

  • PhD in Electrical Engineering or closely related field.
  • Experience designing and simulating electronic devices, components, or systems.
  • Experience using commercial or research software for electrical, electromagnetic, or multiphysics simulation.
  • Experience in laboratory-based experimental research.
  • Experience working on multidisciplinary engineering or research projects.
  • Strong communication and technical report-writing skills.

Responsibilities

  • Design, model, and simulate electronic devices, components, and systems for advanced packaging applications.
  • Develop and validate new electrical design methodologies and optimise advanced packaging processes through experimental research.
  • Translate design concepts into experimentally validated prototypes and demonstrators.
  • Contribute to the development, characterisation, and optimisation of advanced packaging technologies using laboratory-based research.
  • Prepare technical reports, publications, and project presentations.
  • Contribute to research proposal development where appropriate.

Skills

Electronic device design
Simulation experience
Experimental research
Multidisciplinary collaboration
Technical report writing

Education

PhD in Electrical Engineering or related

Tools

Electrical/EM/multiphysics simulation software

Job description

Tyndall National Institute in Cork invites applications for a Post-Doctoral Researcher in Electronic Design and Advanced Packaging. You will join the Photonics Packaging and Systems Integration Group and contribute to EU and industry-funded projects delivering next-generation packaging solutions.

You will design, model, simulate and experimentally validate electronic devices and systems, collaborating across teams to translate concepts into demonstrators and scalable results, with opportunities

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Postdoc: Pioneering Optical Design & Packaging
Postdoc: Pioneering Optical Design & Packaging

Tyndall National Institute • Cork

Hybrid
EUR 47,000 - 54,000
Athena Swan Bronze award
Blended working: remote and on-site
Generous annual leave
Post-Doctoral Researcher in Optical Design and Advanced Packaging
Post-Doctoral Researcher in Optical Design and Advanced Packaging

Tyndall National Institute • Cork

On-site
EUR 47,000 - 54,000
Athena Swan Bronze award
Blended working: remote and on-site
Generous annual leave
Post-Doctoral Researcher in Electronic Design and Advanced Packaging
Post-Doctoral Researcher in Electronic Design and Advanced Packaging

Tyndall National Institute • Cork

Hybrid
EUR 47,000 - 54,000
PhD: Advanced Photonic Packaging & Assembly Design
PhD: Advanced Photonic Packaging & Assembly Design

Tyndall National Institute • Coolmore Cross

On-site
EUR 23,000 - 28,000
Tax-free scholarship
Tuition fees covered
4-year duration
Fully Funded PhD in Photonics Packaging & Integration
Fully Funded PhD in Photonics Packaging & Integration

Tyndall National Institute • Cork

Hybrid
EUR 25,000 - 30,000
Stipend €25,000/year
Tuition fees paid
Travel expenses to conferences
+2
PhD / Masters – Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems
PhD / Masters – Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems

Tyndall National Institute • Cork

Hybrid
EUR 25,000 - 30,000
Stipend €25,000/year
Tuition fees paid
Travel expenses to conferences
+2
PhD / Masters - Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems
PhD / Masters - Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems

Tyndall National Institute • Cork

On-site
EUR 23,000 - 28,000
Tax-free stipend and tuition fees paid
Travel to international conferences
Training and development opportunities
+1
PhD / Masters - Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems
PhD / Masters - Advanced Design, Assembly and Packaging Technologies for Integrated Photonic Systems

Tyndall National Institute • Coolmore Cross

On-site
EUR 23,000 - 28,000
Tax-free scholarship
Tuition fees covered
4-year duration
PhD Scholarship in Novel Electro-Optic Materials and Integrated Photonic Devices for High-Speed Optical Communications
PhD Scholarship in Novel Electro-Optic Materials and Integrated Photonic Devices for High-Speed Optical Communications

Tyndall National Institute • Cork

Hybrid
EUR 25,000 - 30,000
Stipend + tuition
Conference travel
Training & development
+2
PhD Position - Multi-Wavelength Photonic Platforms for Co-Packaged Optics in AI Datacentres
PhD Position - Multi-Wavelength Photonic Platforms for Co-Packaged Optics in AI Datacentres

Tyndall National Institute • West Cork

On-site
EUR 24,000 - 28,000
Full PhD funding including tuition and
Tax-free stipend
Travel to international conferences
+2